We investigated the surface band-to-band tunnelling (BTBT) current under the OFF-state condition in drain-extended MOS (DeMOS) devices. We found significant gate-induced drain leakage current due to surface BTBT, which was also reported earlier as the dominant cause of early time-dependent dielectric breakdown and device failure. Furthermore, a layout solution for the existing DeMOS device is proposed in order to mitigate the surface BTBT current and the associated gate oxide reliability issues, without sacrificing the mixed-signal performance of the device
An analytical expression for gate-induced drain leakage (GIDL) current based on indirect tunneling t...
Gate oxide soft breakdown (SB) can have a severe impact on MOSFET performance even when not producin...
Based on the tunneling current model, a simplified current model is developed for MOS devices after ...
We investigated the surface band-to-band tunnelling (BTBT) current under the off-state condition in ...
The impact of scaling the depth of the shallow trench isolation (STI) region, underneath the gate-to...
The impact of scaling the depth of the shallow trench isolation (STI) region, underneath the gate-to...
The impact of scaling the depth of the shallow trench isolation (STI) region, underneath the gate-to...
Drain corner-field induced band-to-band (B-B) tunneling in thin-oxide MOSFET’s has been identified a...
Breakdown of gate dielectric is one of the most dangerous threats for reliability of MOSFET devices ...
In this paper, the optimization issues of various drain-extended devices are discussed for input/out...
In this paper, the optimization issues of various drain-extended devices are discussed for input/out...
As transistors are getting smaller, it has become increasingly difficult to achieve requisite device...
Static leakage currents represent a major issue in nano-scale CMOS. In digital VLSI circuits, the mo...
In this paper, the impact of majority carriers introduced into the film by gate-body Electron Valenc...
We studied the degradation of MOSFETs with 3.2 nm gate oxide under Fowler Nordheim and channel hot c...
An analytical expression for gate-induced drain leakage (GIDL) current based on indirect tunneling t...
Gate oxide soft breakdown (SB) can have a severe impact on MOSFET performance even when not producin...
Based on the tunneling current model, a simplified current model is developed for MOS devices after ...
We investigated the surface band-to-band tunnelling (BTBT) current under the off-state condition in ...
The impact of scaling the depth of the shallow trench isolation (STI) region, underneath the gate-to...
The impact of scaling the depth of the shallow trench isolation (STI) region, underneath the gate-to...
The impact of scaling the depth of the shallow trench isolation (STI) region, underneath the gate-to...
Drain corner-field induced band-to-band (B-B) tunneling in thin-oxide MOSFET’s has been identified a...
Breakdown of gate dielectric is one of the most dangerous threats for reliability of MOSFET devices ...
In this paper, the optimization issues of various drain-extended devices are discussed for input/out...
In this paper, the optimization issues of various drain-extended devices are discussed for input/out...
As transistors are getting smaller, it has become increasingly difficult to achieve requisite device...
Static leakage currents represent a major issue in nano-scale CMOS. In digital VLSI circuits, the mo...
In this paper, the impact of majority carriers introduced into the film by gate-body Electron Valenc...
We studied the degradation of MOSFETs with 3.2 nm gate oxide under Fowler Nordheim and channel hot c...
An analytical expression for gate-induced drain leakage (GIDL) current based on indirect tunneling t...
Gate oxide soft breakdown (SB) can have a severe impact on MOSFET performance even when not producin...
Based on the tunneling current model, a simplified current model is developed for MOS devices after ...