date of the first integrated circuit to 1971 which has seen the first microprocessor application, the micro-electronics passed from a discrete transistor to MSI integrated circuits with many thousands of integrated components and now to VLSI integrating many hundreds of thousands of devices. Technological recent technological progress permitted the GaAs and its ternary derivative to be the second generation material. So, we present a study on the Gallium arsenide material specifying its transport and electric properties, and its specific advantages over the silicon material. A semi insulating substrate study of a gate Schottky diode for the GaAs MESFET devices manufacturing such as structures with and without buffer layer, with buried gate,...
For VLSI applications, it is essential to have consistent device characteristics for devices fabrica...
Includes bibliographical references (pages 44-49)In this project, an analytical modeling of Gallium ...
A detailed numerical analysis of the source and drain parasitic resistances and effective channel le...
The purpose of the work described in this thesis was to study the use of GaAs MESFETs in digital log...
Gallium arsenide transistors have a distinct advantage over silicon in terms of speed, with much hig...
The use of ion-beam etching for the controllable formation of very thin active channel layers in GaA...
This thesis discusses the electrical response of submicron GaAs MESFETs and HEMTs to develop a physi...
A novel technique for producing submicron gate length GaAs MESFETs has been developed. The technique...
Two 2” Gallium Arsenide wafers underwent MBE deposition processing to create two differing epitaxial...
In the information science and technology such as computer science, telecommunications, processing o...
A refractory self-aligned gate fabrication process for gallium arsenide MESFETs has been developed a...
The purpose of this thesis is to investigate the operation of GaAs field-effect transistors with par...
The authors present a numerical study on electrical methods to measure the source and drain resistan...
The work is a study of the physical processes responsible for the electrical interaction of GaAs dev...
The purpose of this work was to study certain aspects of device fabrication and material properties ...
For VLSI applications, it is essential to have consistent device characteristics for devices fabrica...
Includes bibliographical references (pages 44-49)In this project, an analytical modeling of Gallium ...
A detailed numerical analysis of the source and drain parasitic resistances and effective channel le...
The purpose of the work described in this thesis was to study the use of GaAs MESFETs in digital log...
Gallium arsenide transistors have a distinct advantage over silicon in terms of speed, with much hig...
The use of ion-beam etching for the controllable formation of very thin active channel layers in GaA...
This thesis discusses the electrical response of submicron GaAs MESFETs and HEMTs to develop a physi...
A novel technique for producing submicron gate length GaAs MESFETs has been developed. The technique...
Two 2” Gallium Arsenide wafers underwent MBE deposition processing to create two differing epitaxial...
In the information science and technology such as computer science, telecommunications, processing o...
A refractory self-aligned gate fabrication process for gallium arsenide MESFETs has been developed a...
The purpose of this thesis is to investigate the operation of GaAs field-effect transistors with par...
The authors present a numerical study on electrical methods to measure the source and drain resistan...
The work is a study of the physical processes responsible for the electrical interaction of GaAs dev...
The purpose of this work was to study certain aspects of device fabrication and material properties ...
For VLSI applications, it is essential to have consistent device characteristics for devices fabrica...
Includes bibliographical references (pages 44-49)In this project, an analytical modeling of Gallium ...
A detailed numerical analysis of the source and drain parasitic resistances and effective channel le...