The benefits of using notch, slot and multiple circular perforations in plate fin heat sinks (PFHSs), are investigated numerically, using a conjugate heat transfer model. Comparisons show that each type of perforation can provide significantly reduced pressure drops over PFHSs but that fins with slot perforations provide the most effective design in terms of heat transfer and pressure drop. The practical benefits of each type of perforated fin for micro-electronics cooling is also explored and their capabilities of achieving low processor temperatures for reduced mechanical power consumption are quantified
Experiments were conducted to investigate forced convective cooling performance of an air cooled par...
The usage of the electronic goods has been increased tremendously; hence it is the challenging task ...
Finning or perforations are frequently used in heat exchange devices to increase the heat exchange b...
The benefits of using strip fin heat sinks (SFHSs) where the cross-sectional aspect ratio of the fin...
The benefits of using pin heat sinks (PHSs) with single, rectangular slotted or notched pin perforat...
The benefits of using pin fin heat sinks with multiple perforations are investigated using complemen...
AbstractMicro heat sinks are adopted in electronics cooling together with different technologies to ...
The benefits of using strip fin heat sinks (SFHSs) where the cross-sectional aspect ratio of the fin...
© Springer Nature Singapore Pte Ltd. 2018. The development of semiconductor fabrication process and ...
The development of semiconductor fabrication process and electronic packaging technology causes the ...
The development of semiconductor fabrication process and electronic packaging technology causes the ...
The benefits of using pinned heat sinks (PHSs) with multiple circular, square and elliptic perforati...
Since industrial devices create power dissipation in the form of heat created as a by-product, which...
22-27In the present paper we have investigated the enhancement of the heat transfer using fins with ...
Numerousinvestigations had been attempted to enhance the heat transfer rate from the fins. Heat tran...
Experiments were conducted to investigate forced convective cooling performance of an air cooled par...
The usage of the electronic goods has been increased tremendously; hence it is the challenging task ...
Finning or perforations are frequently used in heat exchange devices to increase the heat exchange b...
The benefits of using strip fin heat sinks (SFHSs) where the cross-sectional aspect ratio of the fin...
The benefits of using pin heat sinks (PHSs) with single, rectangular slotted or notched pin perforat...
The benefits of using pin fin heat sinks with multiple perforations are investigated using complemen...
AbstractMicro heat sinks are adopted in electronics cooling together with different technologies to ...
The benefits of using strip fin heat sinks (SFHSs) where the cross-sectional aspect ratio of the fin...
© Springer Nature Singapore Pte Ltd. 2018. The development of semiconductor fabrication process and ...
The development of semiconductor fabrication process and electronic packaging technology causes the ...
The development of semiconductor fabrication process and electronic packaging technology causes the ...
The benefits of using pinned heat sinks (PHSs) with multiple circular, square and elliptic perforati...
Since industrial devices create power dissipation in the form of heat created as a by-product, which...
22-27In the present paper we have investigated the enhancement of the heat transfer using fins with ...
Numerousinvestigations had been attempted to enhance the heat transfer rate from the fins. Heat tran...
Experiments were conducted to investigate forced convective cooling performance of an air cooled par...
The usage of the electronic goods has been increased tremendously; hence it is the challenging task ...
Finning or perforations are frequently used in heat exchange devices to increase the heat exchange b...