Microstructure and interfacial interaction of polyimide/silica hybrid nanocomposites prepared with 3-aminopropyltriethoxysilane

A series of polyimide (PI)-silica hybrid nanocomposites are prepared from 3,3′,4,4′biphenyltetracarboxylic dianhydride (BPDA)-4,4′-oxydianiline (ODA) polyamic acid (PAA) and tetraethoxysilane(TEOS) or tetramethoxysilane (TMOS) by the sol-gel process. 3-Aminopropyltriethoxysilane (3-APS) is used to enhance the interfacial interaction between polyimide and silica. The morphology, interfacial interaction, and properties of the hybrids are investigated using scanning electron microscope (SEM), UV-vis spectroscopy, atomic force microscope (AFM), Fourier transform infrared spectroscopy (FTIR), and thermogravimetric analysis (TGA). SEM and AFM images indicate that silica particles of ca. 45-55 nm size are uniformly distributed in polyimide matrices and that the interfacial interaction between PI and TEOS is better than that between PI and TMOS. The optical transparencies of the PI/TEOS hybrids are better than that of the PI/TMOS hybrids. FTIR spectra confirm the Si O Si bond as well as the conversion of PAA to polyimide and PI/silica hybrid films. The thermal stability is increased after incorporation of the silicas in the polyimide matrix. © 2003 VSP