Cu-In-microbumps for low-temperature bonding of fine-pitch-interconnects

Bickel, S.
Panchenko, I.
Wahrmund, W.
Neumann, V.
Meyer, J.
Wolf, M.J.

Publication date

January 2017

DOI

10.1109/ECTC.2017.206

Abstract

The advancing heterogeneous integration of various electronic components into a single package requires in particular further development of bonding technologies towards lower temperatures. In our present study, we show the successful joining of dies consisting of Cu-microbumps with In solder caps. Stable interconnections were achieved at a bonding temperature of 180 °C in 2 min by solid-liquid-interdiffusion (SLID)

Extracted data

We use cookies to provide a better user experience.

Data Protection

Cu-In-microbumps for low-temperature bonding of fine-pitch-interconnects

Abstract

Extracted data

Cu-In-microbumps for low-temperature bonding of fine-pitch-interconnects

Abstract

Extracted data

Related items

Related items