Add to ORKGUS8833418; US8833418 B2; US8833418B2; US8,833,418; US 8,833,418 B2; 8833418; Appl. No. 13/340,168US2014-2015 > Other Outputs > Patents grantedVersion of Recor
Adhesives are widely used in the manufacture of electronic devices to act as passive and active comp...
The electrical properties of various lead-free electrically conductive adhesives are investigated. T...
Department of Industrial and Systems EngineeringDepartment of Electrical EngineeringRefereed confere...
US8129220; US8129220 B2; US8129220B2; US8,129,220; US 8,129,220 B2; 8129220; Appl. No. 12/546,207USV...
A method of joining electrically conductive materials comprises: Applying an electrically conductive...
The invention relates to the electrically conductive bond between at least two electrical components...
This new method bonds and connects an integrated circuit (10) to a substrate (26), directly. An anis...
SIGLEAvailable from British Library Document Supply Centre-DSC:6029.28073(243) / BLDSC - British Lib...
SIGLEAvailable from British Library Document Supply Centre-DSC:6029.28073(270) / BLDSC - British Lib...
[[abstract]]A method for bonding an IC chip formed with corrugated, multi-layered bumps to conductiv...
Electrically conductive adhesives are nature friendly joining materials with continuously growing im...
A restriction of the use of lead in electronics can be expected. Conductive adhesives are able to re...
A method of producing electrically insulating, low stress, permanent bonds between components involv...
This final report is a compilation of final reports from each of the groups participating in the pro...
The application relates to a method for determining a bonding connection (1) in a component arrangem...
Adhesives are widely used in the manufacture of electronic devices to act as passive and active comp...
The electrical properties of various lead-free electrically conductive adhesives are investigated. T...
Department of Industrial and Systems EngineeringDepartment of Electrical EngineeringRefereed confere...
US8129220; US8129220 B2; US8129220B2; US8,129,220; US 8,129,220 B2; 8129220; Appl. No. 12/546,207USV...
A method of joining electrically conductive materials comprises: Applying an electrically conductive...
The invention relates to the electrically conductive bond between at least two electrical components...
This new method bonds and connects an integrated circuit (10) to a substrate (26), directly. An anis...
SIGLEAvailable from British Library Document Supply Centre-DSC:6029.28073(243) / BLDSC - British Lib...
SIGLEAvailable from British Library Document Supply Centre-DSC:6029.28073(270) / BLDSC - British Lib...
[[abstract]]A method for bonding an IC chip formed with corrugated, multi-layered bumps to conductiv...
Electrically conductive adhesives are nature friendly joining materials with continuously growing im...
A restriction of the use of lead in electronics can be expected. Conductive adhesives are able to re...
A method of producing electrically insulating, low stress, permanent bonds between components involv...
This final report is a compilation of final reports from each of the groups participating in the pro...
The application relates to a method for determining a bonding connection (1) in a component arrangem...
Adhesives are widely used in the manufacture of electronic devices to act as passive and active comp...
The electrical properties of various lead-free electrically conductive adhesives are investigated. T...
Department of Industrial and Systems EngineeringDepartment of Electrical EngineeringRefereed confere...