Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks. This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tie...
Military and aerospace electronics manufacturers are forced to deal with components that are availab...
The target of this prestudy was to study the reasons of the whisker growth in metals like tin (Sn) a...
Thesis (Ph. D.)--University of Rochester. Dept. of Mechanical Engineering, Materials Science Program...
Tin whisker mitigation: research into mechanisms and strategies. Part 1, Effect of plating methodolo...
Pure tin is currently the most widely employed lead-free finish for plating of component terminals d...
Tin, lead, and lead-tin solders are the most commonly used solders due to their low melting temperat...
For years, the alloy of choice for electroplating electronic components has been tin-lead (Sn-Pb) al...
Tin whiskers are filamentary growths that are formed on the surface of electrodeposited tin, which i...
Tin whisker mitigation: research into mechanisms and strategies. Part 2, Post-plating mitigation met...
Electroplated tin finishes are widely used in the electronics industry due to their excellent solder...
Tin (Sn) whiskers are conductive Sn filaments that grow from Sn-plated surfaces, such as surface fin...
Since the use of the most stable Pb-based materials in the electronic industry has been banned due t...
The objective of this ongoing study is to evaluate the ability of conformal coatings to mitigate the...
Towards green technology application in electronic industry, pure tin as a Pb-free component lead fi...
The effect of electroplating parameters and substrate material on tin whisker formation This item wa...
Military and aerospace electronics manufacturers are forced to deal with components that are availab...
The target of this prestudy was to study the reasons of the whisker growth in metals like tin (Sn) a...
Thesis (Ph. D.)--University of Rochester. Dept. of Mechanical Engineering, Materials Science Program...
Tin whisker mitigation: research into mechanisms and strategies. Part 1, Effect of plating methodolo...
Pure tin is currently the most widely employed lead-free finish for plating of component terminals d...
Tin, lead, and lead-tin solders are the most commonly used solders due to their low melting temperat...
For years, the alloy of choice for electroplating electronic components has been tin-lead (Sn-Pb) al...
Tin whiskers are filamentary growths that are formed on the surface of electrodeposited tin, which i...
Tin whisker mitigation: research into mechanisms and strategies. Part 2, Post-plating mitigation met...
Electroplated tin finishes are widely used in the electronics industry due to their excellent solder...
Tin (Sn) whiskers are conductive Sn filaments that grow from Sn-plated surfaces, such as surface fin...
Since the use of the most stable Pb-based materials in the electronic industry has been banned due t...
The objective of this ongoing study is to evaluate the ability of conformal coatings to mitigate the...
Towards green technology application in electronic industry, pure tin as a Pb-free component lead fi...
The effect of electroplating parameters and substrate material on tin whisker formation This item wa...
Military and aerospace electronics manufacturers are forced to deal with components that are availab...
The target of this prestudy was to study the reasons of the whisker growth in metals like tin (Sn) a...
Thesis (Ph. D.)--University of Rochester. Dept. of Mechanical Engineering, Materials Science Program...