Our research comprises the manufacturing of test structures to characterize the metal-semiconductor junctions with a number of techniques and materials. An extensive subsequent physical and electrical testing of the junctions is carried out. We present our first results on specific silicide-to-diffusion contact resistance characterization using the known Scott's Transmission Line Model (TLM) and our approach, considering particular geometry, with NiSi and PtSi as the silicides
Temperature variation during semiconductor device operation can be significant and how this affects ...
A modified design of the transmission line model test structure uses the simple calculation of speci...
Abstract — We propose and demonstrate a novel test struc-ture to characterize the electrical propert...
Our research comprises the manufacturing of test structures to characterize the metal-semiconductor ...
We present the data on specific silicide-to-silicon contact resistance (�?c) obtained using optimize...
The performance of Si integrated circuits depends on the transistor drive current. The drive current...
Silicide contacts are used in semiconductor devices because of their relatively low sheet resistance...
Advancements in nanotechnology have created the need for efficient means of communication of electri...
Contact resistance measurements were carried out on n+ -Si/Pd2Si, n+ -Si/NiSi, n+ -Si/TiSi2, p+ -Si/...
Analyzing the contact geometry factors for the conventional CBKR structures, it appeared that the co...
The metal resistance in the transmission line model (TLM) structures creates a serious obstacle to d...
The authors report values of contact resistivity for silicon/silicide interfaces, derived by applyin...
In this paper, we have examined different metals (Au, Al, In) Ohmic contacts on spray deposited ZnS ...
The Cox-Strack method is commonly applied to assess the contact resistivity between a metal and a se...
The Cox-Strack method is commonly applied to assess the contact resistivity between a metal and a se...
Temperature variation during semiconductor device operation can be significant and how this affects ...
A modified design of the transmission line model test structure uses the simple calculation of speci...
Abstract — We propose and demonstrate a novel test struc-ture to characterize the electrical propert...
Our research comprises the manufacturing of test structures to characterize the metal-semiconductor ...
We present the data on specific silicide-to-silicon contact resistance (�?c) obtained using optimize...
The performance of Si integrated circuits depends on the transistor drive current. The drive current...
Silicide contacts are used in semiconductor devices because of their relatively low sheet resistance...
Advancements in nanotechnology have created the need for efficient means of communication of electri...
Contact resistance measurements were carried out on n+ -Si/Pd2Si, n+ -Si/NiSi, n+ -Si/TiSi2, p+ -Si/...
Analyzing the contact geometry factors for the conventional CBKR structures, it appeared that the co...
The metal resistance in the transmission line model (TLM) structures creates a serious obstacle to d...
The authors report values of contact resistivity for silicon/silicide interfaces, derived by applyin...
In this paper, we have examined different metals (Au, Al, In) Ohmic contacts on spray deposited ZnS ...
The Cox-Strack method is commonly applied to assess the contact resistivity between a metal and a se...
The Cox-Strack method is commonly applied to assess the contact resistivity between a metal and a se...
Temperature variation during semiconductor device operation can be significant and how this affects ...
A modified design of the transmission line model test structure uses the simple calculation of speci...
Abstract — We propose and demonstrate a novel test struc-ture to characterize the electrical propert...