Abstract—Global on-chip data communication is becoming a concern as the gap between transistor speed and interconnect bandwidth increases with CMOS process scaling. Repeaters can partly bridge this gap, but the classical repeater insertion approach requires a large number of repeaters while the intrinsic data capacity of each interconnect-segment is only partially used. In this paper we analyze interconnects and show how a combination of layout, termination and equalization techniques can significantly increase the data rate for a given length of uninterrupted interconnect. To validate these techniques, a bus-transceiver test chip in a 0.13- m, 1.2-V, 6-M copper CMOS process has been designed. The chip uses 10-mm-long differential interconn...
Abstract—Global on-chip data communication is becoming a concern as the gap between transistor speed...
This paper presents a transceiver for fast and energy-efficient global on-chip communication, consis...
As VLSI progresses into Very Deep Submicron (VDSM) realms, global interconnects play an increasingly...
Abstract—Global on-chip data communication is becoming a concern as the gap between transistor speed...
Abstract—Global on-chip data communication is becoming a concern as the gap between transistor speed...
Global on-chip data communication is becoming a concern as the gap between transistor speed and inte...
Global on-chip communication is receiving quite some attention as global interconnects are rapidly b...
A bus-transceiver chip in 0.13 μm CMOS uses 10mm uninterrupted differential interconnects of 0.8 μm ...
The data rate of global on-chip interconnects (up to 10 mm) is limited by a large distributed resist...
A bus-transceiver test chip in 0.13 μm CMOS achieves 3 Gb/s/ch over 10 mm long uninterrupted differe...
Global on-chip communication is rapidly becoming a speed and power bottleneck in CMOS circuits. In t...
Abstract—Global on-chip data communication is becoming a concern as the gap between transistor speed...
Abstract—This paper presents a set of circuit techniques to achieve high data rate point-to-point co...
Abstract—Crosstalk limits the achievable data rate of global on-chip interconnects on large CMOS ICs...
In the earlier days of the Complementary Metal Oxide Semiconductor (CMOS) industry, much effort was ...
Abstract—Global on-chip data communication is becoming a concern as the gap between transistor speed...
This paper presents a transceiver for fast and energy-efficient global on-chip communication, consis...
As VLSI progresses into Very Deep Submicron (VDSM) realms, global interconnects play an increasingly...
Abstract—Global on-chip data communication is becoming a concern as the gap between transistor speed...
Abstract—Global on-chip data communication is becoming a concern as the gap between transistor speed...
Global on-chip data communication is becoming a concern as the gap between transistor speed and inte...
Global on-chip communication is receiving quite some attention as global interconnects are rapidly b...
A bus-transceiver chip in 0.13 μm CMOS uses 10mm uninterrupted differential interconnects of 0.8 μm ...
The data rate of global on-chip interconnects (up to 10 mm) is limited by a large distributed resist...
A bus-transceiver test chip in 0.13 μm CMOS achieves 3 Gb/s/ch over 10 mm long uninterrupted differe...
Global on-chip communication is rapidly becoming a speed and power bottleneck in CMOS circuits. In t...
Abstract—Global on-chip data communication is becoming a concern as the gap between transistor speed...
Abstract—This paper presents a set of circuit techniques to achieve high data rate point-to-point co...
Abstract—Crosstalk limits the achievable data rate of global on-chip interconnects on large CMOS ICs...
In the earlier days of the Complementary Metal Oxide Semiconductor (CMOS) industry, much effort was ...
Abstract—Global on-chip data communication is becoming a concern as the gap between transistor speed...
This paper presents a transceiver for fast and energy-efficient global on-chip communication, consis...
As VLSI progresses into Very Deep Submicron (VDSM) realms, global interconnects play an increasingly...