Abstract—This paper presents a set of circuit techniques to achieve high data rate point-to-point communication over long on-chip RC-limited wire-pairs. The ideal line termination impedances for a flat transfer function with linear phase (pure delay) are derived, using an s-parameter wire-pair model. It is shown that a driver with series capacitance on the one hand and a resistive load on the other, are fair approximations of these ideal terminations in the frequency range of interest. From a perspective of power efficiency, a capacitive driver is preferred, as the series capacitance reduces the voltage swing along the line which reduces dynamic power consumption. To reduce cross-talk and maintain data integrity, parallel differential inter...
Abstract—Global on-chip data communication is becoming a concern as the gap between transistor speed...
As semiconductor technology advances in the ultra deep sub -micron era, on-chip global interconnecti...
Global on-chip data communication is becoming a concern as the gap between transistor speed and inte...
The data rate of global on-chip interconnects (up to 10 mm) is limited by a large distributed resist...
The performance of many digital systems today is limited by the interconnection bandwidth between ch...
As technology scales, interconnect planning has been widely regarded as one of the most critical fac...
Abstract—Global on-chip data communication is becoming a concern as the gap between transistor speed...
Global on-chip interconnects are a limiting factor in modern high performance VLSI systems due to cr...
Technology trends and especially portable applications are adding a third dimension (power) to the p...
Abstract—Global on-chip data communication is becoming a concern as the gap between transistor speed...
Abstract—Global on-chip data communication is becoming a concern as the gap between transistor speed...
A 3D interconnection scheme based on capacitive coupling for high speed chip to chip communication h...
Abstract—We explore two schemes using transmission-line (T-line) to achieve high-performance global ...
As data and computing systems get larger with more elements composing a single system, streamlined c...
In the earlier days of the Complementary Metal Oxide Semiconductor (CMOS) industry, much effort was ...
Abstract—Global on-chip data communication is becoming a concern as the gap between transistor speed...
As semiconductor technology advances in the ultra deep sub -micron era, on-chip global interconnecti...
Global on-chip data communication is becoming a concern as the gap between transistor speed and inte...
The data rate of global on-chip interconnects (up to 10 mm) is limited by a large distributed resist...
The performance of many digital systems today is limited by the interconnection bandwidth between ch...
As technology scales, interconnect planning has been widely regarded as one of the most critical fac...
Abstract—Global on-chip data communication is becoming a concern as the gap between transistor speed...
Global on-chip interconnects are a limiting factor in modern high performance VLSI systems due to cr...
Technology trends and especially portable applications are adding a third dimension (power) to the p...
Abstract—Global on-chip data communication is becoming a concern as the gap between transistor speed...
Abstract—Global on-chip data communication is becoming a concern as the gap between transistor speed...
A 3D interconnection scheme based on capacitive coupling for high speed chip to chip communication h...
Abstract—We explore two schemes using transmission-line (T-line) to achieve high-performance global ...
As data and computing systems get larger with more elements composing a single system, streamlined c...
In the earlier days of the Complementary Metal Oxide Semiconductor (CMOS) industry, much effort was ...
Abstract—Global on-chip data communication is becoming a concern as the gap between transistor speed...
As semiconductor technology advances in the ultra deep sub -micron era, on-chip global interconnecti...
Global on-chip data communication is becoming a concern as the gap between transistor speed and inte...