The potential dependence of the current and the etch rate of p- and n-type silicon electrodes in 6 M HNO3–6 M HF solution was investigated. Hydrogen evolved during etching at the open-circuit potential was also measured. These results give insight into the different processes occurring during etching. A detailed charge balance for silicon oxidation in the etchant is deduced
The electrochemical etching of (100) n-type Si was investigated in dilute HF solutions containing co...
The anodic dissolution and passivation of n- and p-type Si in different concentrations etching tempe...
In semiconductor and photovoltaic industries numerous process steps deal with etching and silicon su...
The etching of sil icon in HNO3-HF based systems proceeds by a sequen-tial oxidation-followed-by-dis...
The kinetics of the etching of silicon in the system HF, HNO~, and H~O was studied as a function of ...
The etching rate of silicon in fluoride-containing solutions was found to show a remarkable pH depen...
In this work a methodology and metrology for the substrate and dopant loss during cleaning and etchi...
In this work a methodology and metrology for the Si substrate loss characterization during cleaning ...
In Part I of this work, the bias dependence of the etching of silicon (111) has been investigated by...
The different equilibria in HF and HF /HCI solutions are examined and the etching reaction of S iQ i...
In Part I of this work, the bias dependence of the etching of silicon (111) has been investigated by...
Gas phase etching of single- and polycrystalline silicon using a mixture of HF/H2O and O3 has been i...
The anodic dissolution and passivation of n- and p-type Si in different concentrations of hydrazine ...
Abstract. The etch rate of n-type Si in diluted HF solutions was investigated as a function of the b...
The anodic dissolution and passivation of n- and p-type Si in different concentrations etching tempe...
The electrochemical etching of (100) n-type Si was investigated in dilute HF solutions containing co...
The anodic dissolution and passivation of n- and p-type Si in different concentrations etching tempe...
In semiconductor and photovoltaic industries numerous process steps deal with etching and silicon su...
The etching of sil icon in HNO3-HF based systems proceeds by a sequen-tial oxidation-followed-by-dis...
The kinetics of the etching of silicon in the system HF, HNO~, and H~O was studied as a function of ...
The etching rate of silicon in fluoride-containing solutions was found to show a remarkable pH depen...
In this work a methodology and metrology for the substrate and dopant loss during cleaning and etchi...
In this work a methodology and metrology for the Si substrate loss characterization during cleaning ...
In Part I of this work, the bias dependence of the etching of silicon (111) has been investigated by...
The different equilibria in HF and HF /HCI solutions are examined and the etching reaction of S iQ i...
In Part I of this work, the bias dependence of the etching of silicon (111) has been investigated by...
Gas phase etching of single- and polycrystalline silicon using a mixture of HF/H2O and O3 has been i...
The anodic dissolution and passivation of n- and p-type Si in different concentrations of hydrazine ...
Abstract. The etch rate of n-type Si in diluted HF solutions was investigated as a function of the b...
The anodic dissolution and passivation of n- and p-type Si in different concentrations etching tempe...
The electrochemical etching of (100) n-type Si was investigated in dilute HF solutions containing co...
The anodic dissolution and passivation of n- and p-type Si in different concentrations etching tempe...
In semiconductor and photovoltaic industries numerous process steps deal with etching and silicon su...