Hot Wire CVD (also called Catalytic CVD or initiated CVD) is an elegant low pressure deposition technique for the deposition of functional films, both inorganic and organic, based on the decomposition of precursor sources at a heated metallic surface. The conformal deposition of thin films on rigid substrates or flexible foil substrates, whether in-line or batch type, is very straightforward, since it is plasma-free (i.e. without the risk of a damaging bombardment of energetic ions) and it is easily scalable. An increasing variety of thin film materials can be obtained with this method, with good feedstock gas utilization and high deposition rate. Progress has been made in establishing stable and reproducible conditions for the hot catalyti...
In this paper we investigated the deposition process of the fluoropolymer coatings by the method of ...
Abstract. Using Hot Wire Chemical Vapor Deposition (HWCVD), also known as thermocatalytic decomposit...
NOTICE: this is the author’s version of a work that was accepted for publication in Thin Solid Films...
The research effort in the field of Hot Wire CVD (also called Catalytic CVD or initiated CVD) has in...
The need for large quantities of rapidly and cheaply produced electronic devices has increased rapid...
The technology of Hot Wire Chemical Vapor Deposition (HWCVD) or Catalytic Chemical Vapor Deposition ...
The activation of low pressure gas phases by hot filaments for chemical vapour deposition (CVD) of t...
Hot Wire Chemical Vapor Deposition (HWCVD) is a very suitable technique for homogeneous deposition o...
The consequences of implementing a Hot Wire Chemical Vapor Deposition (HWCVD) chamber into an existi...
This book provides an overview of chemical vapor deposition (CVD) methods and recent advances in dev...
Hot wire CVD (HWCVD) and initiated CVD (iCVD) are very well suited deposition techniques for the fab...
A new chemical vapour deposition (CVD) technique is presented. It is especially advantageous for the...
Today the Very Large Scale Industry (VLSI) is looking towards process solutions, which will avoid th...
Silicon-based films such as hydrogenated amorphous silicon (a-Si:H), nanocrystalline silicon (nc-Si:...
A dual hot-wire arrangement has been designed and investigated for the deposition of various thin fi...
In this paper we investigated the deposition process of the fluoropolymer coatings by the method of ...
Abstract. Using Hot Wire Chemical Vapor Deposition (HWCVD), also known as thermocatalytic decomposit...
NOTICE: this is the author’s version of a work that was accepted for publication in Thin Solid Films...
The research effort in the field of Hot Wire CVD (also called Catalytic CVD or initiated CVD) has in...
The need for large quantities of rapidly and cheaply produced electronic devices has increased rapid...
The technology of Hot Wire Chemical Vapor Deposition (HWCVD) or Catalytic Chemical Vapor Deposition ...
The activation of low pressure gas phases by hot filaments for chemical vapour deposition (CVD) of t...
Hot Wire Chemical Vapor Deposition (HWCVD) is a very suitable technique for homogeneous deposition o...
The consequences of implementing a Hot Wire Chemical Vapor Deposition (HWCVD) chamber into an existi...
This book provides an overview of chemical vapor deposition (CVD) methods and recent advances in dev...
Hot wire CVD (HWCVD) and initiated CVD (iCVD) are very well suited deposition techniques for the fab...
A new chemical vapour deposition (CVD) technique is presented. It is especially advantageous for the...
Today the Very Large Scale Industry (VLSI) is looking towards process solutions, which will avoid th...
Silicon-based films such as hydrogenated amorphous silicon (a-Si:H), nanocrystalline silicon (nc-Si:...
A dual hot-wire arrangement has been designed and investigated for the deposition of various thin fi...
In this paper we investigated the deposition process of the fluoropolymer coatings by the method of ...
Abstract. Using Hot Wire Chemical Vapor Deposition (HWCVD), also known as thermocatalytic decomposit...
NOTICE: this is the author’s version of a work that was accepted for publication in Thin Solid Films...