Comparative investigations were performed using high-depth-resolution Rutherford backscattering (RBS) combined with channeling, spectroellipsometry (SE) and atomic force microscopy (AFM) to analyze surface disorder and surface roughness formed during plasma immersion implantation of silicon (100) substrates in a gas mixture containing PH3. In order to enhance the sensitivity to the determination of the oxygen content of the surface oxide layer, the 3.05 MeV (4He+, 4He+) nuclear resonance was used in combination with channeling. For the analysis of SE data we used the method in which an appropriate optical model is assumed and a best fit to the model parameters is obtained (i.e. the thickness of surface oxide and damaged silicon layers and t...
High depth resolution medium energy ion scattering (MEIS) has been used to examine the influence of ...
Plasma etching processes are widely used to produce patterns in the fabrication of microelectronic d...
The main topic of this thesis is experimental analysis of material surfaces using scanning probe mic...
High-depth-resolution Rutherford Backscattering Spectrometry (RBS) combined with channeling techniqu...
The anomalous surface formed in silicon by room temperature Si, Ar and Kr implantation has been exam...
Spectroscopic ellipsometry (SE), high-depth-resolution Rutherford backscattering (RBS) and channelin...
This project is concerned with the Rutherford back-scattering (RBS) analysis of silicon oxide layers...
The damaging effect of mono- and diatomic phosphorus and arsenic ions implanted into silicon was inv...
Rutherford backscattering channeling (RBS-C) spectra of ion-implanted Si are simulated according to ...
Silicon substrate damage caused by HBr/O2 plasma exposure was investigated by spectroscopic ellipsom...
We previously developed a fitting method of several parameters to evaluate ion-implantation-caused d...
Ultra-shallow (below 20 nm) disorder profiles have been characterized by spectroscopic ellipsometry ...
Samples produced by plasma immersion ion implantation of Arsenic in Silicon using a non-pulsed plasm...
The production of modern integrated circuits relies upon plasma processing to achieve the necessary ...
Plasma doping (PLAD) is increasingly applied in microelectronic device manufacture to produce high t...
High depth resolution medium energy ion scattering (MEIS) has been used to examine the influence of ...
Plasma etching processes are widely used to produce patterns in the fabrication of microelectronic d...
The main topic of this thesis is experimental analysis of material surfaces using scanning probe mic...
High-depth-resolution Rutherford Backscattering Spectrometry (RBS) combined with channeling techniqu...
The anomalous surface formed in silicon by room temperature Si, Ar and Kr implantation has been exam...
Spectroscopic ellipsometry (SE), high-depth-resolution Rutherford backscattering (RBS) and channelin...
This project is concerned with the Rutherford back-scattering (RBS) analysis of silicon oxide layers...
The damaging effect of mono- and diatomic phosphorus and arsenic ions implanted into silicon was inv...
Rutherford backscattering channeling (RBS-C) spectra of ion-implanted Si are simulated according to ...
Silicon substrate damage caused by HBr/O2 plasma exposure was investigated by spectroscopic ellipsom...
We previously developed a fitting method of several parameters to evaluate ion-implantation-caused d...
Ultra-shallow (below 20 nm) disorder profiles have been characterized by spectroscopic ellipsometry ...
Samples produced by plasma immersion ion implantation of Arsenic in Silicon using a non-pulsed plasm...
The production of modern integrated circuits relies upon plasma processing to achieve the necessary ...
Plasma doping (PLAD) is increasingly applied in microelectronic device manufacture to produce high t...
High depth resolution medium energy ion scattering (MEIS) has been used to examine the influence of ...
Plasma etching processes are widely used to produce patterns in the fabrication of microelectronic d...
The main topic of this thesis is experimental analysis of material surfaces using scanning probe mic...