A Langmuir-Hinshelwood growth-rate equation is presented for the germanium-silicon (GeSi) alloy deposition fromGeH4 and SiH4 assuming dissociative chemisorption on a heterogeneous GeSi surface. Model parameters for the depositionkinetics have been extracted from measurements. The fit for the bond-energy of hydrogen to a germanium surface site is30 kJ mol–1, lower compared to that of hydrogen to a silicon site. We found to a good approximation the GeSi compositionof the alloy to be independent of the temperature. Moreover, the GeSi is polycrystalline down to the lowest depositiontemperature we used, ie., 450°
A study of low-pressure chemical vapor deposition LPCVD of GexSi1−x x 0.65 films was carried out. Th...
Abstract. In this paper a thermodynamic and kinetic study of the new deposition process of tungsten ...
Abstract- Over the years, the design of chemical vapor deposition processes has relied on accumulate...
A Langmuir-Hinshelwood growth-rate equation is presented for the germanium-silicon (GeSi) alloy depo...
The deposition of silicon (Si) from silane (SiH4) was studied in the silane pressure range from 0.5 ...
The kinetics of the deposition of polycrystalline silicon from silane were studied at 25–125 Pa and ...
GexSi1-x epilayers were grown at 700-900 degrees C by atmospheric pressure chemical vapour depositio...
A numerical model that combines mass transport and surface kinetics was applied, for the first time,...
In this paper a thermodynamic and kinetic study of the new deposition process of tungsten on Silicon...
The growth rate R of Si(001), Ge(001), and $\rm Si\sb{1-x}Ge\sb{x}(001)$ films deposited on Si(001)2...
We report on the growth of SiGe/Si heterostructures in a commercial chemical vapor deposition cold-w...
This paper presents results on the deposition of Si1-xGex layers in a hot wall low pressure chemical...
A Langmuir–Hinshelwood‐type kinetic model is developed for modeling growth of silicon–germanium allo...
A study of low-pressure chemical vapor deposition (LPCVD) of GexSi1-��x (x<0.65) films was carried o...
Low-temperature Si and Ge CVD processing was investigated under the cleanest possible reaction envir...
A study of low-pressure chemical vapor deposition LPCVD of GexSi1−x x 0.65 films was carried out. Th...
Abstract. In this paper a thermodynamic and kinetic study of the new deposition process of tungsten ...
Abstract- Over the years, the design of chemical vapor deposition processes has relied on accumulate...
A Langmuir-Hinshelwood growth-rate equation is presented for the germanium-silicon (GeSi) alloy depo...
The deposition of silicon (Si) from silane (SiH4) was studied in the silane pressure range from 0.5 ...
The kinetics of the deposition of polycrystalline silicon from silane were studied at 25–125 Pa and ...
GexSi1-x epilayers were grown at 700-900 degrees C by atmospheric pressure chemical vapour depositio...
A numerical model that combines mass transport and surface kinetics was applied, for the first time,...
In this paper a thermodynamic and kinetic study of the new deposition process of tungsten on Silicon...
The growth rate R of Si(001), Ge(001), and $\rm Si\sb{1-x}Ge\sb{x}(001)$ films deposited on Si(001)2...
We report on the growth of SiGe/Si heterostructures in a commercial chemical vapor deposition cold-w...
This paper presents results on the deposition of Si1-xGex layers in a hot wall low pressure chemical...
A Langmuir–Hinshelwood‐type kinetic model is developed for modeling growth of silicon–germanium allo...
A study of low-pressure chemical vapor deposition (LPCVD) of GexSi1-��x (x<0.65) films was carried o...
Low-temperature Si and Ge CVD processing was investigated under the cleanest possible reaction envir...
A study of low-pressure chemical vapor deposition LPCVD of GexSi1−x x 0.65 films was carried out. Th...
Abstract. In this paper a thermodynamic and kinetic study of the new deposition process of tungsten ...
Abstract- Over the years, the design of chemical vapor deposition processes has relied on accumulate...