Kelvin probe force microscopy in ultrahigh vacuum was used to study inhomogeneities of the contact potential difference (CPD) and differential capacitance of thin atomic layer deposited Al2O3 films. CPD fluctuations correlate equally strongly with the surface topography for deposition on hydrogen-terminated Si and thermal SiO2. The correlation of the differential capacitance with the topography clearly distinguishes films based on the starting surface. The lateral electrical homogeneity of these thin oxides depends crucially on their initial nucleation
The electrical properties of cluster-assembled nanostructured palladium oxide _ns-PdOx_ thin films g...
Atomic layer deposition (ALD) of Al2O3 is of interest for a wide range of micro-nanoelectronic appli...
International audienceAbstract High- k materials are needed to minimise the gate leakage current in ...
Ultrathin 2.5 nm high-k aluminum oxide (Al2O3) films on p-type silicon (001) deposited by atomic lay...
Fixed oxide charges in atomic layer deposited (ALD) Al2O3 on hydrogen-terminated Si were observed by...
In this work, the applicability of scanning capacitance microscopy SCM for film thickness characteri...
In the nanometric regime, alumina films are often deposited by ALD methods yet in industrial applica...
Abstract. A home-built Kelvin force microscope combined with a spectroscopic method is dedicated to ...
High-k dielectric layers (HfSixOy and ZrO2) with different film morphologies were investigated by tu...
Surface potential distributions in ultra-thin (0.8-3.9 nm) LaAlO3 layers deposited on SrTiO3 substra...
In the present diploma project work, metal oxide semiconductor capacitors were fabricated on Silicon...
We investigate the influence of the roughness at a nanometre scale on the electrical capacitance of ...
At the present time large bodies of extensive studies exist on the electrical characterization of At...
We studied the effective contact potential difference (ECPD) of thin film nanostructures and its rol...
Atomic layer deposition (ALD) is potentially a very suitable deposition technology to grow ultra thi...
The electrical properties of cluster-assembled nanostructured palladium oxide _ns-PdOx_ thin films g...
Atomic layer deposition (ALD) of Al2O3 is of interest for a wide range of micro-nanoelectronic appli...
International audienceAbstract High- k materials are needed to minimise the gate leakage current in ...
Ultrathin 2.5 nm high-k aluminum oxide (Al2O3) films on p-type silicon (001) deposited by atomic lay...
Fixed oxide charges in atomic layer deposited (ALD) Al2O3 on hydrogen-terminated Si were observed by...
In this work, the applicability of scanning capacitance microscopy SCM for film thickness characteri...
In the nanometric regime, alumina films are often deposited by ALD methods yet in industrial applica...
Abstract. A home-built Kelvin force microscope combined with a spectroscopic method is dedicated to ...
High-k dielectric layers (HfSixOy and ZrO2) with different film morphologies were investigated by tu...
Surface potential distributions in ultra-thin (0.8-3.9 nm) LaAlO3 layers deposited on SrTiO3 substra...
In the present diploma project work, metal oxide semiconductor capacitors were fabricated on Silicon...
We investigate the influence of the roughness at a nanometre scale on the electrical capacitance of ...
At the present time large bodies of extensive studies exist on the electrical characterization of At...
We studied the effective contact potential difference (ECPD) of thin film nanostructures and its rol...
Atomic layer deposition (ALD) is potentially a very suitable deposition technology to grow ultra thi...
The electrical properties of cluster-assembled nanostructured palladium oxide _ns-PdOx_ thin films g...
Atomic layer deposition (ALD) of Al2O3 is of interest for a wide range of micro-nanoelectronic appli...
International audienceAbstract High- k materials are needed to minimise the gate leakage current in ...