Testing should be evaluated as the ability of the test patterns to cover realistic faults, and high quality IC products demand high quality testing. We use a test strategy based on physical design for testability (to discover both open and short faults, which are difficult or even impossible to detect). Consequentially, layout level design for testability (LLDFT) rules have been developed, which prevent the faults, or at least reduce the chance of their appearing. The main purpose of this work is to apply a practical set of LLDFT rules to the library cells designed by the Centre Nacional de Microelectrònica (CNM) and obtain a highly testable cell library. The main results of the application of the LLDFT rules (area overheads and performance...
Testability of CMOS faults has been a matter of concern for a long time. Most probably the fault cov...
The continued scaling of integrated circuits (ICs) introduces complex interactions between layout fe...
Due to their large number of high-precision, defect-prone manufacturing steps, integrated circuits (...
Testing should be evaluated as the ability of the test patterns to cover realistic faults, and high ...
The layout level design for testability (LLDFT) rules used here allow to avoid some hard to detect f...
In order to achieve a good level of reliability we use a test strategy based on Layout Level Design ...
Testing should be evaluated as the ability of the test patterns to cover realistic faults, and high ...
Present research in design for testability has largely been confined to the logic level. In this pap...
The main objective of this project is to design testability features that can potentially be include...
This paper develops a Physical Design for Test (PDFT) metric that is directly related to the expecte...
The layout of a circuit can influence the probability of occurrence of faults. In this paper, we dev...
Cell-aware test (CAT) explicitly targets faults caused by defects inside library cells to improve te...
Faulty chips will reach customer if IC testing is not performed on the fabricated IC. Simple types o...
We present in this paper a new concept of test sequence generation for realistic faults in CMOS ICs ...
Advanced technology nodes employ a large number of innovations. In addition, they require 'scaling b...
Testability of CMOS faults has been a matter of concern for a long time. Most probably the fault cov...
The continued scaling of integrated circuits (ICs) introduces complex interactions between layout fe...
Due to their large number of high-precision, defect-prone manufacturing steps, integrated circuits (...
Testing should be evaluated as the ability of the test patterns to cover realistic faults, and high ...
The layout level design for testability (LLDFT) rules used here allow to avoid some hard to detect f...
In order to achieve a good level of reliability we use a test strategy based on Layout Level Design ...
Testing should be evaluated as the ability of the test patterns to cover realistic faults, and high ...
Present research in design for testability has largely been confined to the logic level. In this pap...
The main objective of this project is to design testability features that can potentially be include...
This paper develops a Physical Design for Test (PDFT) metric that is directly related to the expecte...
The layout of a circuit can influence the probability of occurrence of faults. In this paper, we dev...
Cell-aware test (CAT) explicitly targets faults caused by defects inside library cells to improve te...
Faulty chips will reach customer if IC testing is not performed on the fabricated IC. Simple types o...
We present in this paper a new concept of test sequence generation for realistic faults in CMOS ICs ...
Advanced technology nodes employ a large number of innovations. In addition, they require 'scaling b...
Testability of CMOS faults has been a matter of concern for a long time. Most probably the fault cov...
The continued scaling of integrated circuits (ICs) introduces complex interactions between layout fe...
Due to their large number of high-precision, defect-prone manufacturing steps, integrated circuits (...