Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab
- Tilmans, H.A.C.
- Ziad, H.
- Jansen, Henricus V.
- Di Monaco, O.
- Jourdain, A.
- De Raedt, W.
- Rottenberg, X.
- De Backer, E.
- Decoussernaeker, A.
- Baert, K.
Publication date
December 2001
DOIAbstract
Reports on wafer-level packaged RF-MEMS switches fabricated in a commercial CMOS fab. Switch fabrication is based on a metal surface micromachining process. A novel wafer-level packaging scheme is developed, whereby the switches are housed in on-chip sealed cavities using benzocyclobutene (BCB) as the bonding and sealing material. Measurements show that the influence of the wafer-level package on the RF performance can be made very smal
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