Advancements in integrated circuits demand an increasing requirement for a faster, low-cost non-volatile memory with improved scaling potential. Phase change memory is an important emerging memory technology qualifying these requirements. With dimensional scaling, the contacts are scaled by F2, therefore knowledge of the contact properties becomes even more important. This thesis deals with the characterization of electrical contacts for phase change memory cells. An electrical contact in this respect refers to the interfaces formed in the memory cell, i.e. the metal electrode to phase change material (PCM) contacts in the crystalline and in the amorphous state
We have investigated the contact resistivity of GeCu2Te3 (GCT) phase change material to a W electrod...
The impact of junction formed by the electrode and bulk in phase change memory to conduction at the ...
MasterPhase change random access memory(PCRAM) using chalcogenide materials, which can be reversibly...
Advancements in integrated circuits demand an increasing requirement for\ud a faster, low-cost non-v...
For phase change random access memory (PCRAM) cells, it is important to know the contact resistance ...
We have investigated the interfacial contact properties of the CMOS compatible electrode materials W...
Knowledge of contact resistance of phase change materials (PCM) to metal electrodes is important for...
In the design of phase-change memory (PCM), it is important to perform numerical simulations topredi...
In the design of phase-change memory (PCM), it is important to perform numerical simulations to pred...
Electrical characterisation of metal to Phase Change Material (PCM) contacts is necessary for optimu...
Phase change memory PCM is an emerging technology that combines the unique properties of phase ch...
Phase change materials, typically composed out of Ge, Sb and Te alloys, are materials that can switc...
Phase change materials (PCM) based memory device is considered as one of the most promising candidat...
This paper investigates the impact of contact resistance on the memory window in phase-change random...
With respect to the operation of a Phase-change Random Access Memory (PRAM or PcRAM), we studied the...
We have investigated the contact resistivity of GeCu2Te3 (GCT) phase change material to a W electrod...
The impact of junction formed by the electrode and bulk in phase change memory to conduction at the ...
MasterPhase change random access memory(PCRAM) using chalcogenide materials, which can be reversibly...
Advancements in integrated circuits demand an increasing requirement for\ud a faster, low-cost non-v...
For phase change random access memory (PCRAM) cells, it is important to know the contact resistance ...
We have investigated the interfacial contact properties of the CMOS compatible electrode materials W...
Knowledge of contact resistance of phase change materials (PCM) to metal electrodes is important for...
In the design of phase-change memory (PCM), it is important to perform numerical simulations topredi...
In the design of phase-change memory (PCM), it is important to perform numerical simulations to pred...
Electrical characterisation of metal to Phase Change Material (PCM) contacts is necessary for optimu...
Phase change memory PCM is an emerging technology that combines the unique properties of phase ch...
Phase change materials, typically composed out of Ge, Sb and Te alloys, are materials that can switc...
Phase change materials (PCM) based memory device is considered as one of the most promising candidat...
This paper investigates the impact of contact resistance on the memory window in phase-change random...
With respect to the operation of a Phase-change Random Access Memory (PRAM or PcRAM), we studied the...
We have investigated the contact resistivity of GeCu2Te3 (GCT) phase change material to a W electrod...
The impact of junction formed by the electrode and bulk in phase change memory to conduction at the ...
MasterPhase change random access memory(PCRAM) using chalcogenide materials, which can be reversibly...