This chapter explores the micromachining of fluidic structures in silicon, and presents several examples of demonstrated functionality of devices in silicon. An often-used method for micromachining of silicon is anisotropic wet chemical etching. This is the most frequently used for the fabrication of membranes for pressure sensors. Such membranes may also serve as check valves or membranes in micropumps. The main advantage of anisotropic etching is the limited design freedom in the fabrication of channels with sharp bends but this method also allows the largest degree of freedom of structural design. Glass shows excellent chemical and optical properties and allows a variety of design possibilities. To obtain the desired microstructures in g...
A new, versatile architecture is presented for microfluidic devices made entirely from glass, for us...
Although silicon may generally not be the material of first choice for applications in the field of ...
During the last decades, miniaturization of electrical components and systems has assumed large prop...
Silicon micromachining (1), the generation of three-dimensional microstructures in silicon by planar...
This paper describes the main protocols that are used for fabricating microfluidic devices from glas...
This paper describes the main protocols that are used for fabricating microfluidic devices from glas...
This paper presents processes for glass micromachining, including sandblast, wet etching, reactive i...
This thesis introduces important improvements in fabrication of microfluidic devices on silicon and ...
This thesis introduces important improvements in fabrication of microfluidic devices on silicon and ...
In this chapter, silicon electrochemical micromachining (ECM) technology is reviewed with particular...
In this chapter, silicon electrochemical micromachining (ECM) technology is reviewed with particular...
In this chapter, silicon electrochemical micromachining (ECM) technology is reviewed with particular...
In this chapter, silicon electrochemical micromachining (ECM) technology is reviewed with particular...
μTAS is hot in micromechanics today. All μTAS devices contain channels to connect the different comp...
AbstractThis paper studies on micro fabrication methods for MEMS. Silicon micromachining has been a ...
A new, versatile architecture is presented for microfluidic devices made entirely from glass, for us...
Although silicon may generally not be the material of first choice for applications in the field of ...
During the last decades, miniaturization of electrical components and systems has assumed large prop...
Silicon micromachining (1), the generation of three-dimensional microstructures in silicon by planar...
This paper describes the main protocols that are used for fabricating microfluidic devices from glas...
This paper describes the main protocols that are used for fabricating microfluidic devices from glas...
This paper presents processes for glass micromachining, including sandblast, wet etching, reactive i...
This thesis introduces important improvements in fabrication of microfluidic devices on silicon and ...
This thesis introduces important improvements in fabrication of microfluidic devices on silicon and ...
In this chapter, silicon electrochemical micromachining (ECM) technology is reviewed with particular...
In this chapter, silicon electrochemical micromachining (ECM) technology is reviewed with particular...
In this chapter, silicon electrochemical micromachining (ECM) technology is reviewed with particular...
In this chapter, silicon electrochemical micromachining (ECM) technology is reviewed with particular...
μTAS is hot in micromechanics today. All μTAS devices contain channels to connect the different comp...
AbstractThis paper studies on micro fabrication methods for MEMS. Silicon micromachining has been a ...
A new, versatile architecture is presented for microfluidic devices made entirely from glass, for us...
Although silicon may generally not be the material of first choice for applications in the field of ...
During the last decades, miniaturization of electrical components and systems has assumed large prop...