Analyzing the contact geometry factors for the conventional CBKR structures, it appeared that the contact geometries conventionally used for the metal-to-silicide contact resistance measurements were not always satisfactory to reveal the specific contact resistance values. To investigate these geometry-related issues, we therefore designed and realized new CBKR structures having a large variety of contact shapes, overlaps and diffusion area widths. The process flow was adjusted for self-aligned silicides as well as for planar silicide structures
Abstract—The Cross-Kelvin Resistor test structure is commonly used for the extraction of the specifi...
Contact resistance measurements were carried out on n+ -Si/Pd2Si, n+ -Si/NiSi, n+ -Si/TiSi2, p+ -Si/...
This article reports on the characterization of two- and three-layer ohmic contacts comprising of ti...
Analyzing the contact geometry factors for the conventional CBKR structures, it appeared that the co...
A convenient test structure for measurement of the specific contact resistance (�?c) of metal-semico...
Abstract—The parasitic factors that strongly influence the mea-surement accuracy of Cross-Bridge Kel...
The parasitic factors that strongly influence the measurement accuracy of Cross-Bridge Kelvin Resist...
Silicide contacts are used in semiconductor devices because of their relatively low sheet resistance...
Our research comprises the manufacturing of test structures to characterize the metal-semiconductor ...
Our research comprises the manufacturing of test structures to characterize the metal-semiconductor ...
Various test structures have been employed to determine the specific contact resistivity (rhoc) of o...
The contact resistance between two materials is dependent on the intrinsic properties of the materia...
The parasitic factors that strongly influence the measurement accuracy of cross-bridge Kelvin resist...
Abstract-A vertical Kelvin test structure is used to measure tln 2 spe-cific contact resistivity of ...
The performance of Si integrated circuits depends on the transistor drive current. The drive current...
Abstract—The Cross-Kelvin Resistor test structure is commonly used for the extraction of the specifi...
Contact resistance measurements were carried out on n+ -Si/Pd2Si, n+ -Si/NiSi, n+ -Si/TiSi2, p+ -Si/...
This article reports on the characterization of two- and three-layer ohmic contacts comprising of ti...
Analyzing the contact geometry factors for the conventional CBKR structures, it appeared that the co...
A convenient test structure for measurement of the specific contact resistance (�?c) of metal-semico...
Abstract—The parasitic factors that strongly influence the mea-surement accuracy of Cross-Bridge Kel...
The parasitic factors that strongly influence the measurement accuracy of Cross-Bridge Kelvin Resist...
Silicide contacts are used in semiconductor devices because of their relatively low sheet resistance...
Our research comprises the manufacturing of test structures to characterize the metal-semiconductor ...
Our research comprises the manufacturing of test structures to characterize the metal-semiconductor ...
Various test structures have been employed to determine the specific contact resistivity (rhoc) of o...
The contact resistance between two materials is dependent on the intrinsic properties of the materia...
The parasitic factors that strongly influence the measurement accuracy of cross-bridge Kelvin resist...
Abstract-A vertical Kelvin test structure is used to measure tln 2 spe-cific contact resistivity of ...
The performance of Si integrated circuits depends on the transistor drive current. The drive current...
Abstract—The Cross-Kelvin Resistor test structure is commonly used for the extraction of the specifi...
Contact resistance measurements were carried out on n+ -Si/Pd2Si, n+ -Si/NiSi, n+ -Si/TiSi2, p+ -Si/...
This article reports on the characterization of two- and three-layer ohmic contacts comprising of ti...