Due to high performance demands of the consumer electronics and processing systems, like servers, the number of cores is increasing on System-on-Chip (SoC). Network-on-Chip (NoC) is suitable approach for reducing the communication bottleneck of multicore System-on-Chip. With the integration of 3D IC technology, the 3D Network-on-Chip design enhances the execution rate and decreases power utilisation by replacing long flat interconnects with short vertical ones. New compact architectures are possible by arranging the cores in three-dimensions. Optimised routing algorithms can provide higher execution speed along with reduced energy consumption. In this paper an efficient routing algorithm for 3D Torus topology architecture is proposed. A mod...
Several interesting topologies emerge by incorporating the third dimension in networks-on-chip (NoC)...
Abstract—Three-dimensional (3D) integration offers greater device integration, reduced signal delay ...
International audienceNowadays 3D chips are fabricated by stacking 2D layers and manufacturing verti...
SummaryDue to high performance demands of the consumer electronics and processing systems, like serv...
In recent years, the enhancement of microchip technologies has enabled large scale Systems-on-Chip (...
Three dimensional Networks-on-Chip (3D NoCs) have attracted a growing interest to solve on-chip comm...
In recent years, the enhancement of microchip technologies has enabled large scale Systems-on-Chip (...
AbstractNetwork-on-Chip (NoC) has been recognized as an effective solution for complex on-chip commu...
International audienceExisting routing algorithms for 3D deal with regular mesh/torus 3D topologies....
With the use of multi-core architectures, the Network-on-Chip (NoC) became an important research top...
With the increasing capacity of FPGAs following the Moore's law, it is possible to build in a single...
In essence, Network-on-Chip (NoC) also known as on-chip interconnection network has been proposed as...
3-D Networks-on-Chip (NoCs) have been proposed as a potent solution to address both the interconnect...
Three-Dimensional (3D) integration is a solution to the interconnect bottleneck in Two-Dimensional (...
This work is devoted to the study of communication subsystem of networks-on-chip (NoCs) development ...
Several interesting topologies emerge by incorporating the third dimension in networks-on-chip (NoC)...
Abstract—Three-dimensional (3D) integration offers greater device integration, reduced signal delay ...
International audienceNowadays 3D chips are fabricated by stacking 2D layers and manufacturing verti...
SummaryDue to high performance demands of the consumer electronics and processing systems, like serv...
In recent years, the enhancement of microchip technologies has enabled large scale Systems-on-Chip (...
Three dimensional Networks-on-Chip (3D NoCs) have attracted a growing interest to solve on-chip comm...
In recent years, the enhancement of microchip technologies has enabled large scale Systems-on-Chip (...
AbstractNetwork-on-Chip (NoC) has been recognized as an effective solution for complex on-chip commu...
International audienceExisting routing algorithms for 3D deal with regular mesh/torus 3D topologies....
With the use of multi-core architectures, the Network-on-Chip (NoC) became an important research top...
With the increasing capacity of FPGAs following the Moore's law, it is possible to build in a single...
In essence, Network-on-Chip (NoC) also known as on-chip interconnection network has been proposed as...
3-D Networks-on-Chip (NoCs) have been proposed as a potent solution to address both the interconnect...
Three-Dimensional (3D) integration is a solution to the interconnect bottleneck in Two-Dimensional (...
This work is devoted to the study of communication subsystem of networks-on-chip (NoCs) development ...
Several interesting topologies emerge by incorporating the third dimension in networks-on-chip (NoC)...
Abstract—Three-dimensional (3D) integration offers greater device integration, reduced signal delay ...
International audienceNowadays 3D chips are fabricated by stacking 2D layers and manufacturing verti...