Electrodeposition of Platinum Thin Films as Interconnects Material for Implantable Medical Applications

Biocompatible platinum (Pt) thin film electrodeposition on TiN substrates, as plating seed layer, using dihydrogendinitrosulfatoplatinate and hexachloroplatinate plating baths is investigated. Cyclic voltammetry was used for identifying the reduction mechanism of Pt ions and the proper plating conditions from both electrolytes. This was followed by a detailed study for Pt nucleation and early growth stages using galvanostatic deposition over a wide range of current density. Pt films, with hundreds of nanometers thickness, were successfully plated without delamination. The plated Pt films were comparable to those sputtered, with good adhesion to the seed layer and low levels of chemical impurities. Best plating conditions were successfully applied to the fabrication of Pt interconnects on flexible substrates and showed good flexibility and adhesion post-release between interconnects and the substrate. (C) 2013 The Electrochemical Society. All rights reserved