This paper deals with influence of soldered joint geometry on measurement of its mechanical properties. Mechanical properties of soldered lap-joints of four lead-free solders with different geometry were measured. In conclusion using of samples with one interface solder – soldered material for measurement of soldered joints mechanical properties is recommended
This article presents research focused on the reliability of soldered joints. The quality of solder ...
International audienceThe following study is motivated by the need to capture the elasto-viscoplasti...
220 p.Reliability of solder joints is a most critical issue in electronic packaging. There is the ur...
This paper deals with influence of soldered joint geometry on measurement of its mechanical properti...
This thesis deals with the differences between the mechanical properties of surface conditionings of...
This paper deals with relationship of soldering profile, void formation and mechanical strength of r...
This paper deals with relationship of soldering profile, void formation and mechanical strength of r...
Solder joint, strength, measurement, SMD, THTThis thesis studies the definition of solder joint stre...
This thesis studies the definition of solder joint strength and its contributing factors. It also ev...
The project contains theoretical research of electrotechnical manufacture for lead-free reflow solde...
This paper focuses on publishing the review of mechanical properties at the interface between SnAgCu...
This thesis deals with problematic of lead – free soldering and consequent testing of mechanical cha...
Předkládaná bakalářská práce je zaměřena na používané zkoušky pro zjištění mechanických vlastností p...
Spots resulted by electrical soldering must ensure a mechanical strength of solder comparable to oth...
The paper presents some theoretical and experimental aspects regarding the tribological performances...
This article presents research focused on the reliability of soldered joints. The quality of solder ...
International audienceThe following study is motivated by the need to capture the elasto-viscoplasti...
220 p.Reliability of solder joints is a most critical issue in electronic packaging. There is the ur...
This paper deals with influence of soldered joint geometry on measurement of its mechanical properti...
This thesis deals with the differences between the mechanical properties of surface conditionings of...
This paper deals with relationship of soldering profile, void formation and mechanical strength of r...
This paper deals with relationship of soldering profile, void formation and mechanical strength of r...
Solder joint, strength, measurement, SMD, THTThis thesis studies the definition of solder joint stre...
This thesis studies the definition of solder joint strength and its contributing factors. It also ev...
The project contains theoretical research of electrotechnical manufacture for lead-free reflow solde...
This paper focuses on publishing the review of mechanical properties at the interface between SnAgCu...
This thesis deals with problematic of lead – free soldering and consequent testing of mechanical cha...
Předkládaná bakalářská práce je zaměřena na používané zkoušky pro zjištění mechanických vlastností p...
Spots resulted by electrical soldering must ensure a mechanical strength of solder comparable to oth...
The paper presents some theoretical and experimental aspects regarding the tribological performances...
This article presents research focused on the reliability of soldered joints. The quality of solder ...
International audienceThe following study is motivated by the need to capture the elasto-viscoplasti...
220 p.Reliability of solder joints is a most critical issue in electronic packaging. There is the ur...