In this study, optical emission spectroscopy (OES) was performed to detect etch end-point during the etching of GaN/AlGaN-based devices. In-situ OES experiments during the etching were carried out to measure the etch product signals of AlGaN/GaN heterostructures as well as single III-nitrides. A possibility of detecting etch end-point by OES was identified for both optoelectronic devices and electronic devices using etch product emissions such as Al (396.1 nm) and Ga (417.2 nm)
The effect of an etch-back step to control the cavity length within GaN-based microcavities formed b...
Cathodoluminescence (CL) microscopy and spectroscopy have been used to investigate the optical prope...
Abstract: In semiconductor wafer fabrication, etching is one of the most critical processes, by whi...
In this study, optical emission spectroscopy (OES) was performed to detect etch end-point during the...
Optical Emission Spectroscopy was implemented for determining the endpoint of film removal through d...
Optical emission spectroscopy has been appl ied to precise end point detection in plasma etching (1-...
Roughening by anisotropic etching of N-face gallium nitride is the key aspect in today's production ...
The objective of this experiment is to obtain an endpoint detection unit that can be used on all pla...
This paper shows the selective etching process of an AlInN sacrificial layer, lattice-matched to GaN...
Gallium nitride (GaN) has proven to be a semiconductor material system that is ideal for the develop...
Photoelectrochemical etching of GaN in different solutions such as KOH, HF/H2O2/C2H5OH a...
(OEI) combines the advantages of Optical Emission Spectroscopy (OES) and laser interferometry. Radia...
Photoenhanced electrochemical (PEC) etching in an unstirred KOH solution under He–Cd laser illuminat...
International audienceLaser interferometry and optical emission spectroscopy are well known techniqu...
[[abstract]]Photoelectrochemical (PEC) etching technique has been proven to be an effective method t...
The effect of an etch-back step to control the cavity length within GaN-based microcavities formed b...
Cathodoluminescence (CL) microscopy and spectroscopy have been used to investigate the optical prope...
Abstract: In semiconductor wafer fabrication, etching is one of the most critical processes, by whi...
In this study, optical emission spectroscopy (OES) was performed to detect etch end-point during the...
Optical Emission Spectroscopy was implemented for determining the endpoint of film removal through d...
Optical emission spectroscopy has been appl ied to precise end point detection in plasma etching (1-...
Roughening by anisotropic etching of N-face gallium nitride is the key aspect in today's production ...
The objective of this experiment is to obtain an endpoint detection unit that can be used on all pla...
This paper shows the selective etching process of an AlInN sacrificial layer, lattice-matched to GaN...
Gallium nitride (GaN) has proven to be a semiconductor material system that is ideal for the develop...
Photoelectrochemical etching of GaN in different solutions such as KOH, HF/H2O2/C2H5OH a...
(OEI) combines the advantages of Optical Emission Spectroscopy (OES) and laser interferometry. Radia...
Photoenhanced electrochemical (PEC) etching in an unstirred KOH solution under He–Cd laser illuminat...
International audienceLaser interferometry and optical emission spectroscopy are well known techniqu...
[[abstract]]Photoelectrochemical (PEC) etching technique has been proven to be an effective method t...
The effect of an etch-back step to control the cavity length within GaN-based microcavities formed b...
Cathodoluminescence (CL) microscopy and spectroscopy have been used to investigate the optical prope...
Abstract: In semiconductor wafer fabrication, etching is one of the most critical processes, by whi...