Low cost access to advanced technologies for prototyping and small volume

International audienceThis paper is about the CMP Service (Circuits Multi-Projects). CMP aims at providing SMEs with the possibility to have their integrated circuits fabricated. Beyong the multiproject wafer policy which reduce the fabrication cost CMP offers today advanced technologies which includes CMOS 0.6 µ, BICMOS 0.8 µ, a digital GaAs 0.6 µ, and a HEMT GaAs 0.2 µ. Recently the 0.25 µ CMOS process from SGS-Thomson has been added to the portfolio. Micro Electro Mechanical Systems (MEMS) are also provided through standard CMP runs in CMOS , BiCMOS 1.2 µ and HEMT GaAs 0.2 µ, using compatible front-side bulk micromachining. Finally, the main processes for Multi Chip Modules (MCMs) are also accessible through CMP. These last 5 years the quality of the CMP Service has attracted industrial companies. In 1997, 85 circuits were submitted for industrial purposes, and 48 circuits were fabricated in low volume