International audienceThe major failure mode of power IGBT is the thermal fatigue of the solder joints. The thermal heating induces mechanical constraints due to the various coefficients of thermal expansion of different materials. The life in fatigue, bound to the non-elastic energy dissipated during acycle, depends strongly onthegeometrical shape ofsolder, onthenon-linear behaviour and on the applied load. The reliability methods are then applied here with response surface method and neural networks.Le mode de défaillance principal des modules de puissance IGBT est la fatigue thermique des joints de soudure. L’échauffement thermique provoque des contraintes mécaniques dues aux différents coefficients de dilatation thermique des matériaux ...
On board electric vehicles (EVs) and hybrid (HEV), the functions of traction is provided by power el...
The authors have proposed the estimating method of thermal fatigue reliability for solder joints of ...
Dans le cadre d'une étude de fiabilité menée sur des composants d'électronique de puissance destinés...
The weak point for the standard power IGBT modules in terms of reliability is thermal fatigue in sol...
Colloque avec actes et comité de lecture. Internationale.International audienceThe major failure mod...
Cette thèse a pour objet l'étude de la fiabilité de modules de puissance triphasés à IGBTs 200 A - 6...
Though, significant efforts have led to high solder joint quality, thermomechanical fatigue and dela...
Cette thèse vise à réaliser des développements théoriques et numériques portant sur le comportement ...
The work presented in this thesis focused on the study of thermo-mechanical fatigue of IGBT power mo...
People’s living today is much enriched by electronic products: computers, mobile phones, LCD TVs, di...
In this paper, an Insulated Gate Bipolar Transistor (IGBT) module designed for aeronautic applicatio...
Le sujet de thèse porte sur le vieillissement des modules de puissance à semi-conducteurs. En foncti...
The lifetime of an IGBT power electronics module under cyclic temperature loading conditions has be...
Lifetime of power electronic devices, in particular those used for wind turbines, is short due to th...
Printed board assemblies, i.e. components soldered on printed circuit boards (PCBs), are exposed to ...
On board electric vehicles (EVs) and hybrid (HEV), the functions of traction is provided by power el...
The authors have proposed the estimating method of thermal fatigue reliability for solder joints of ...
Dans le cadre d'une étude de fiabilité menée sur des composants d'électronique de puissance destinés...
The weak point for the standard power IGBT modules in terms of reliability is thermal fatigue in sol...
Colloque avec actes et comité de lecture. Internationale.International audienceThe major failure mod...
Cette thèse a pour objet l'étude de la fiabilité de modules de puissance triphasés à IGBTs 200 A - 6...
Though, significant efforts have led to high solder joint quality, thermomechanical fatigue and dela...
Cette thèse vise à réaliser des développements théoriques et numériques portant sur le comportement ...
The work presented in this thesis focused on the study of thermo-mechanical fatigue of IGBT power mo...
People’s living today is much enriched by electronic products: computers, mobile phones, LCD TVs, di...
In this paper, an Insulated Gate Bipolar Transistor (IGBT) module designed for aeronautic applicatio...
Le sujet de thèse porte sur le vieillissement des modules de puissance à semi-conducteurs. En foncti...
The lifetime of an IGBT power electronics module under cyclic temperature loading conditions has be...
Lifetime of power electronic devices, in particular those used for wind turbines, is short due to th...
Printed board assemblies, i.e. components soldered on printed circuit boards (PCBs), are exposed to ...
On board electric vehicles (EVs) and hybrid (HEV), the functions of traction is provided by power el...
The authors have proposed the estimating method of thermal fatigue reliability for solder joints of ...
Dans le cadre d'une étude de fiabilité menée sur des composants d'électronique de puissance destinés...