International audienceDifferential scanning calorimetry (DSC) is one of the most used methods for kinetic studies of thermoset cure reactions. The basic assumption made in this technique is the proportionality between the heat generation rate and cure reaction rate. To have access to the heat generation rate that provides information about reaction kinetics, one must know the baseline under the measured curve. Various methods of baseline construction are described and recommended, but most thermoset cure kinetic studies only use a straight line between the exothermal peak start and the end. The influence of changes in the sample's heat capacity is rarely taken into consideration. The use of data obtained with this type of baseline to determ...
Cure kinetic model is an integral part of composite process simulation, which is used to predict the...
Introduction High sensitive Differential scanning calorimetry (DSC) is the only technique giving di...
This project investigates the thermal kinetics of curing for DAPCO 18-4F silicone system by obtainin...
International audienceDifferential scanning calorimetry (DSC) is one of the most used methods for ki...
International audienceIn this work, temperature modulated DSC is used to measure the heat flow evolv...
This research presents a cure kinetics study of an epoxy system consisting of a partially bio-source...
ABSTRACT Epoxy resin is one of the most important polymeric matrixes for diverse uses, such as aeron...
Curing kinetics of an industrially important printedcircuitboard (PCB) base material (epoxy–phenol/g...
Dynamic DSC scans have been used to study the kinetics of a commercial polyester resin for pultrusio...
Polymer curing is an essential part of electronic manufacturing process. Most electronic components ...
Differential scanning calorimetry (DSC) was used at different heating rates to study the cure kineti...
Kinetic equation parameters for the curing reaction of a commercial glass fiber reinforced high perf...
The effect of the addition of p-aminophenol and aniline-based epoxy diluents on the curing behavior ...
In this work, a method is presented which allows the determination of calorimetric information, and ...
New approaches to the analysis of differential scanning calorimetry (DSC) data relating to pro-teins...
Cure kinetic model is an integral part of composite process simulation, which is used to predict the...
Introduction High sensitive Differential scanning calorimetry (DSC) is the only technique giving di...
This project investigates the thermal kinetics of curing for DAPCO 18-4F silicone system by obtainin...
International audienceDifferential scanning calorimetry (DSC) is one of the most used methods for ki...
International audienceIn this work, temperature modulated DSC is used to measure the heat flow evolv...
This research presents a cure kinetics study of an epoxy system consisting of a partially bio-source...
ABSTRACT Epoxy resin is one of the most important polymeric matrixes for diverse uses, such as aeron...
Curing kinetics of an industrially important printedcircuitboard (PCB) base material (epoxy–phenol/g...
Dynamic DSC scans have been used to study the kinetics of a commercial polyester resin for pultrusio...
Polymer curing is an essential part of electronic manufacturing process. Most electronic components ...
Differential scanning calorimetry (DSC) was used at different heating rates to study the cure kineti...
Kinetic equation parameters for the curing reaction of a commercial glass fiber reinforced high perf...
The effect of the addition of p-aminophenol and aniline-based epoxy diluents on the curing behavior ...
In this work, a method is presented which allows the determination of calorimetric information, and ...
New approaches to the analysis of differential scanning calorimetry (DSC) data relating to pro-teins...
Cure kinetic model is an integral part of composite process simulation, which is used to predict the...
Introduction High sensitive Differential scanning calorimetry (DSC) is the only technique giving di...
This project investigates the thermal kinetics of curing for DAPCO 18-4F silicone system by obtainin...