A series of boron nitride (BN) composites, with different BN content, were prepared and characterized by cationic curing of DGEBA/BN formulations. As cationic initiator a commercial benzylanilinium salt was used. This cationic system shows good latent characteristics that were not lost on adding the filler. The performance of the catalytic system was optimized by varying the amount of initiator and adding little proportions of glycerol. The kinetics of the curing process was evaluated by calorimetric measurements. The addition of BN allowed increasing thermal conductivity without loss of mechanical properties like Young modulus, impact resistance, adhesion and other thermal characteristics like Tg or thermal stability. In addition, dielectr...
It has been seen previously that addition of fillers to host material systems can create composites ...
Epoxy resin is a common adhesive bonding material used to join dissimilar materials, especially in t...
As modern electronics are developed towards miniaturisation, high-degree integration and intelligent...
A series of boron nitride (BN) composites, with different BN content, were prepared and characterize...
Thermal dissipation is a critical aspect for the performance and lifetime of electronic devices. In ...
Epoxy resin composites filled with thermally conductive but electrically insulating particles play a...
Epoxy composites containing boron nitride (BN) or aluminum nitride (AlN or Al2N3) particles have bee...
Epoxy resin is one of the most widely used thermosetting polymers and commonly applied in power elec...
An epoxy-thiol system filled with boron nitride (BN), in the form of 80 µm agglomerates, has been in...
It remains a major challenge to develop insulating polymeric composites with high thermal conductivi...
Castable particulate-filled epoxy resins exhibiting excellent thermal conductivity have been prepare...
This work demonstrates that the application of even moderate pressures during cure can result in a r...
An epoxy-thiol system filled with boron nitride (BN), in the form of 80 µm agglomerates, has been in...
The principal objective of this TFG is to investigate the enhancement of the thermal conductivity of...
Boron nitride(BN) nanometer material was adding as filler to epoxy resin to obtain a high thermal co...
It has been seen previously that addition of fillers to host material systems can create composites ...
Epoxy resin is a common adhesive bonding material used to join dissimilar materials, especially in t...
As modern electronics are developed towards miniaturisation, high-degree integration and intelligent...
A series of boron nitride (BN) composites, with different BN content, were prepared and characterize...
Thermal dissipation is a critical aspect for the performance and lifetime of electronic devices. In ...
Epoxy resin composites filled with thermally conductive but electrically insulating particles play a...
Epoxy composites containing boron nitride (BN) or aluminum nitride (AlN or Al2N3) particles have bee...
Epoxy resin is one of the most widely used thermosetting polymers and commonly applied in power elec...
An epoxy-thiol system filled with boron nitride (BN), in the form of 80 µm agglomerates, has been in...
It remains a major challenge to develop insulating polymeric composites with high thermal conductivi...
Castable particulate-filled epoxy resins exhibiting excellent thermal conductivity have been prepare...
This work demonstrates that the application of even moderate pressures during cure can result in a r...
An epoxy-thiol system filled with boron nitride (BN), in the form of 80 µm agglomerates, has been in...
The principal objective of this TFG is to investigate the enhancement of the thermal conductivity of...
Boron nitride(BN) nanometer material was adding as filler to epoxy resin to obtain a high thermal co...
It has been seen previously that addition of fillers to host material systems can create composites ...
Epoxy resin is a common adhesive bonding material used to join dissimilar materials, especially in t...
As modern electronics are developed towards miniaturisation, high-degree integration and intelligent...