International audienceIn this work, temperature modulated DSC is used to measure the heat flow evolved during the cure reaction of a dicyanate ester resin. This technique enables the heat capacity contribution to be separated from the heat source term (from the kinetic behavior) in nonisothermal conditions. At any given moment, therefore, the true reaction rate can be calculated without any assumptions about the shape of the baseline of the thermogram. Result-ing accurate data are used for the characterization of cure kinetics. The isoconversional analysis shows that the apparent activation energy varies with conversion degree, so that a Kamal & Sourour kinetic model is proposed. Its kinetic parameters are obtained by an inverse method, and...
The non-isothermal reaction kinetics of cyanate ester system was investigated by dynamic differentia...
This project investigates the thermal kinetics of curing for DAPCO 18-4F silicone system by obtainin...
During the packaging of electronic components stresses are generated due to curing effects and the d...
International audienceIn this work, temperature modulated DSC is used to measure the heat flow evolv...
[[abstract]]The cure of a novolac-type cyanate ester monomer, which reacts to form a polycyanurate n...
International audienceDifferential scanning calorimetry (DSC) is one of the most used methods for ki...
The curing reaction of furan resins was monitored through the exothermic heat of reaction by means o...
The kinetic parameters (activation energy and pre-exponential) for curing of benzoxazine resins have...
In this work a holistic approach for the characterization and mathematical modeling of the reaction ...
In this work a holistic approach for the characterization and mathematical modeling of the reaction ...
International audienceThe Time-Temperature-Transformation (TTT) isothermal diagram is plotted for a ...
In this work, the characterisation of reaction kinetics of a methylene diphenyl diisocyanate (MDI)-b...
This research presents a cure kinetics study of an epoxy system consisting of a partially bio-source...
A methodology is presented to obtain a kinetic model for curing reactions, from conversion against t...
Dynamic DSC scans have been used to study the kinetics of a commercial polyester resin for pultrusio...
The non-isothermal reaction kinetics of cyanate ester system was investigated by dynamic differentia...
This project investigates the thermal kinetics of curing for DAPCO 18-4F silicone system by obtainin...
During the packaging of electronic components stresses are generated due to curing effects and the d...
International audienceIn this work, temperature modulated DSC is used to measure the heat flow evolv...
[[abstract]]The cure of a novolac-type cyanate ester monomer, which reacts to form a polycyanurate n...
International audienceDifferential scanning calorimetry (DSC) is one of the most used methods for ki...
The curing reaction of furan resins was monitored through the exothermic heat of reaction by means o...
The kinetic parameters (activation energy and pre-exponential) for curing of benzoxazine resins have...
In this work a holistic approach for the characterization and mathematical modeling of the reaction ...
In this work a holistic approach for the characterization and mathematical modeling of the reaction ...
International audienceThe Time-Temperature-Transformation (TTT) isothermal diagram is plotted for a ...
In this work, the characterisation of reaction kinetics of a methylene diphenyl diisocyanate (MDI)-b...
This research presents a cure kinetics study of an epoxy system consisting of a partially bio-source...
A methodology is presented to obtain a kinetic model for curing reactions, from conversion against t...
Dynamic DSC scans have been used to study the kinetics of a commercial polyester resin for pultrusio...
The non-isothermal reaction kinetics of cyanate ester system was investigated by dynamic differentia...
This project investigates the thermal kinetics of curing for DAPCO 18-4F silicone system by obtainin...
During the packaging of electronic components stresses are generated due to curing effects and the d...