A peel test device was used to monitor metal-polymer adhesion. This technique showed variations in the resulting force within 1%, and enabled the ranking of many systems. A change in the 50 nm-adhesion layer resulted in a variation of the fracture energy by a factor 2.3. A change of the substrate led to a change in adhesion by a factor 40. The peeling results were also combined with attenuated total reflectance Fourier transform infra-red measurements to provide qualitative insight of the bonds at the substrate surface. Differences were also visible after surface pretreatment by plasma or sputter etching with different gases, as changes in interaction bonds as well as in adhesion were observed. © 2008 Elsevier B.V. All rights reserved
Delamination owed to misfit and thermal stresses is a relevant concern in the field of microelectron...
Delamination owed to misfit and thermal stresses is a relevant concern in the field of microelectron...
Delamination owed to misfit and thermal stresses is a relevant concern in the field of microelectron...
There is a lack of test methodologies for metal adhesion on polymeric substrates. Current measuremen...
Practical work of adhesion measurements are being studied for several types of polymer/metal combina...
Standard peel tests for aerospace laminates based on metal–polymer systems, namely floating-roller a...
Standard peel tests for aerospace laminates based on metal–polymer systems, namely floating-roller a...
In this study, a test technique, referred to as the probe test, has been developed as a quantitative...
The standard 90° peel test was modified in order to apply it to testing adhesion of thin polymer fil...
The application of peel tests for the measurement of adhesive fracture toughness of metal-polymer la...
The application of peel tests for the measurement of adhesive fracture toughness of metal-polymer la...
The application of peel tests for the measurement of adhesive fracture toughness of metal-polymer la...
The peel adhesion between two different electroless-plated Cu layers and polymer substrates was stud...
In order for the thermal spray industry to progress, informative and reliable coating evaluation te...
In order for the thermal spray industry to progress, informative and reliable coating evaluation te...
Delamination owed to misfit and thermal stresses is a relevant concern in the field of microelectron...
Delamination owed to misfit and thermal stresses is a relevant concern in the field of microelectron...
Delamination owed to misfit and thermal stresses is a relevant concern in the field of microelectron...
There is a lack of test methodologies for metal adhesion on polymeric substrates. Current measuremen...
Practical work of adhesion measurements are being studied for several types of polymer/metal combina...
Standard peel tests for aerospace laminates based on metal–polymer systems, namely floating-roller a...
Standard peel tests for aerospace laminates based on metal–polymer systems, namely floating-roller a...
In this study, a test technique, referred to as the probe test, has been developed as a quantitative...
The standard 90° peel test was modified in order to apply it to testing adhesion of thin polymer fil...
The application of peel tests for the measurement of adhesive fracture toughness of metal-polymer la...
The application of peel tests for the measurement of adhesive fracture toughness of metal-polymer la...
The application of peel tests for the measurement of adhesive fracture toughness of metal-polymer la...
The peel adhesion between two different electroless-plated Cu layers and polymer substrates was stud...
In order for the thermal spray industry to progress, informative and reliable coating evaluation te...
In order for the thermal spray industry to progress, informative and reliable coating evaluation te...
Delamination owed to misfit and thermal stresses is a relevant concern in the field of microelectron...
Delamination owed to misfit and thermal stresses is a relevant concern in the field of microelectron...
Delamination owed to misfit and thermal stresses is a relevant concern in the field of microelectron...