In this work, the impact of ammonium sulfide ((NH4)(2)S) surface treatment on the electrical passivation of the Al2O3/p-GaSb interface is studied for varying sulfide concentrations. Prior to atomic layer deposition of Al2O3, GaSb surfaces were treated in 1%, 5%, 10%, and 22% (NH4)(2)S solutions for 10 min at 295 K. The smallest stretch-out and flatband voltage shifts coupled with the largest capacitance swing, as indicated by capacitance-voltage (CV) measurements, were obtained for the 1% treatment. The resulting interface defect trap density (D-it) distribution showed a minimum value of 4 x 10(12) cm(-2)eV(-1) at E-v + 0.27 eV. Transmission electron microscopy and atomic force microscopy examination revealed the formation of interfacial la...
A recently developed As2S3 chemical treatment was used to passivate the perimeters of self‐aligned h...
Surface sulfur passivation on InP substrate was performed using a dry process rapid thermal annealin...
This thesis investigates the surface cleaning procedures, passivation and interface formation follow...
In this work, the impact of ammonium sulfide ((NH<sub>4</sub>)<sub>2</sub>S)...
III-V materials have emerged as potential candidates to replace silicon in metal-oxide-semiconductor...
International audienceIn this work, the Al2O3/GaSb interface has been studied by x-ray photoelectron...
In this work, we present the results of an investigation into the effectiveness of varying ammonium ...
Atomic-layer-deposited Al2O3 films were grown on ultrathin-body In-0.53 Ga0.47As substrates for IIIV...
This work develops a (NH4)2S/Al2O3 passivation technique for photodiode-based GaSb/AlAsSb heterostru...
We have investigated the impacts of NH3 remote-plasma treatment with various plasma exposure times o...
The results of an investigation into the impact of in situ H2 plasma exposure on the electrical prop...
학위논문 (박사)-- 서울대학교 대학원 : 재료공학부, 2015. 8. 황철성.Approaching with speed limit for nano-electronic device ...
The results of an investigation into the impact of in situ H2 plasma exposure on the electrical prop...
The effects of the Al2O3 interfacial layer (IL) insertion and the neutralized (NH4)2S solution passi...
The GaSb surface was exposed to various HCl-based chemical treatments in order to prepare it for hig...
A recently developed As2S3 chemical treatment was used to passivate the perimeters of self‐aligned h...
Surface sulfur passivation on InP substrate was performed using a dry process rapid thermal annealin...
This thesis investigates the surface cleaning procedures, passivation and interface formation follow...
In this work, the impact of ammonium sulfide ((NH<sub>4</sub>)<sub>2</sub>S)...
III-V materials have emerged as potential candidates to replace silicon in metal-oxide-semiconductor...
International audienceIn this work, the Al2O3/GaSb interface has been studied by x-ray photoelectron...
In this work, we present the results of an investigation into the effectiveness of varying ammonium ...
Atomic-layer-deposited Al2O3 films were grown on ultrathin-body In-0.53 Ga0.47As substrates for IIIV...
This work develops a (NH4)2S/Al2O3 passivation technique for photodiode-based GaSb/AlAsSb heterostru...
We have investigated the impacts of NH3 remote-plasma treatment with various plasma exposure times o...
The results of an investigation into the impact of in situ H2 plasma exposure on the electrical prop...
학위논문 (박사)-- 서울대학교 대학원 : 재료공학부, 2015. 8. 황철성.Approaching with speed limit for nano-electronic device ...
The results of an investigation into the impact of in situ H2 plasma exposure on the electrical prop...
The effects of the Al2O3 interfacial layer (IL) insertion and the neutralized (NH4)2S solution passi...
The GaSb surface was exposed to various HCl-based chemical treatments in order to prepare it for hig...
A recently developed As2S3 chemical treatment was used to passivate the perimeters of self‐aligned h...
Surface sulfur passivation on InP substrate was performed using a dry process rapid thermal annealin...
This thesis investigates the surface cleaning procedures, passivation and interface formation follow...