Add to ORKGThis compilation covers NASA and AEC developed techniques covering bonding, brazing, and joining met...
Design and development of input/output processor and voter-comparator switch concept of guidance and...
This Interface Specification (IFS) identifies, defines, and controls the interface between the Reusa...
Fabrication of tantalum alloy honeycomb core structure for lithium cooled reacto
Transfer, injection, and compression in pressure molding for electronic component
Electronic circuits with specialized computer applications and control circuits are presented. Paten...
Flight test and evaluative data relating to design and use of elastomeric shield materials for therm...
Potting and conformal coating material testing for protective electronic encapsulatio
Components and techniques which may be useful in the electronics industry are described. Topics disc...
Topics: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems;...
The objective of this document is to update the NASA roadmap on packaging technologies (initially re...
Insight is provided into the scientific rotationale for materials processing in space (MPS), and a c...
Topics: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems;...
Developments in electronic components, subsystems, and equipment are summarized. Topics discussed in...
Polyurethane foam and casting resin for encapsulation, reinforcement, and sealing electronic equipme...
This compilation covers NASA and AEC developed techniques covering bonding, brazing, and joining met...
Design and development of input/output processor and voter-comparator switch concept of guidance and...
This Interface Specification (IFS) identifies, defines, and controls the interface between the Reusa...
Fabrication of tantalum alloy honeycomb core structure for lithium cooled reacto
Transfer, injection, and compression in pressure molding for electronic component
Electronic circuits with specialized computer applications and control circuits are presented. Paten...
Flight test and evaluative data relating to design and use of elastomeric shield materials for therm...
Potting and conformal coating material testing for protective electronic encapsulatio
Components and techniques which may be useful in the electronics industry are described. Topics disc...
Topics: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems;...
The objective of this document is to update the NASA roadmap on packaging technologies (initially re...
Insight is provided into the scientific rotationale for materials processing in space (MPS), and a c...
Topics: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems;...
Developments in electronic components, subsystems, and equipment are summarized. Topics discussed in...
Polyurethane foam and casting resin for encapsulation, reinforcement, and sealing electronic equipme...
This compilation covers NASA and AEC developed techniques covering bonding, brazing, and joining met...
Design and development of input/output processor and voter-comparator switch concept of guidance and...
This Interface Specification (IFS) identifies, defines, and controls the interface between the Reusa...