Temperature and film thickness are expected to have an influence on the mechanical properties of thin films. However, mechanical testing of ultrathin metallic films at elevated temperatures is difficult, and few experiments have been conducted to date. Here, we present a systematic study of the mechanical properties of 80-500-nm-thick polycrystalline Au films with and without SiNx passivation layers in the temperature range from 123 to 473 K. The films were tested by a novel synchrotron-based tensile testing technique. Pure Au films showed strong temperature dependence above 373 K, which may be explained by diffusional creep. In contrast, passivated samples appeared to deform by thermally activated dislocation glide. The observed activation...
Thesis (Ph.D.), Materials Science and Engineering Program, Washington State UniversityNano-scale str...
A novel strain-rate jump method was developed for the plane-strain bulge test and used to investigat...
AbstractCreep crack propagation experiments on Au freestanding films of ˜240 nm and ˜390 nm thicknes...
The mechanical behavior of freestanding thin sputter-deposited films of Au is studied at temperature...
Nanocrystalline metal films are candidate materials for microelectronics and Microelectromechanical ...
International audienceThe dependence on thermal history of the plasticity mechanisms occurring in na...
A prerequisite for the study of the scaling behavior of mechanical properties of ultra thin films is...
This paper describes the nanoindentation technique for measuring sputter-deposited Au and Cu thin fi...
Traditionally, time-dependent properties of nanocrystalline metals have been measured on bulk sample...
The effect of strain rate on the inelastic properties of nanocrystalline Au films was quantified wit...
The effect of strain rate on the inelastic properties of nanocrystalline Au films was quantified wit...
Thin films are complex systems exhibiting remarkable mechanical properties compared to their bulk co...
This work presents the characterization of the stress-strain behavior of an electroplated gold layer...
AbstractModern design and engineering of highly efficient devices and machines demand innovative mat...
cited By 6International audienceThis study unveils the stress relaxation transient deformation mecha...
Thesis (Ph.D.), Materials Science and Engineering Program, Washington State UniversityNano-scale str...
A novel strain-rate jump method was developed for the plane-strain bulge test and used to investigat...
AbstractCreep crack propagation experiments on Au freestanding films of ˜240 nm and ˜390 nm thicknes...
The mechanical behavior of freestanding thin sputter-deposited films of Au is studied at temperature...
Nanocrystalline metal films are candidate materials for microelectronics and Microelectromechanical ...
International audienceThe dependence on thermal history of the plasticity mechanisms occurring in na...
A prerequisite for the study of the scaling behavior of mechanical properties of ultra thin films is...
This paper describes the nanoindentation technique for measuring sputter-deposited Au and Cu thin fi...
Traditionally, time-dependent properties of nanocrystalline metals have been measured on bulk sample...
The effect of strain rate on the inelastic properties of nanocrystalline Au films was quantified wit...
The effect of strain rate on the inelastic properties of nanocrystalline Au films was quantified wit...
Thin films are complex systems exhibiting remarkable mechanical properties compared to their bulk co...
This work presents the characterization of the stress-strain behavior of an electroplated gold layer...
AbstractModern design and engineering of highly efficient devices and machines demand innovative mat...
cited By 6International audienceThis study unveils the stress relaxation transient deformation mecha...
Thesis (Ph.D.), Materials Science and Engineering Program, Washington State UniversityNano-scale str...
A novel strain-rate jump method was developed for the plane-strain bulge test and used to investigat...
AbstractCreep crack propagation experiments on Au freestanding films of ˜240 nm and ˜390 nm thicknes...