In this study we tune the chemical mechanical polishing process to a 3-D level to generate controlled nanostructures on functional metallic surfaces such as titanium implants and steel based heating elements. The chemical passivation action of the CMP process on metallic surfaces enables the formation of inert interfaces resistant to corrosion and degradation while the induced nanostructures help tune the surface attachment/detachment ability as these surfaces interact with alternative external elements
Increasing reliance on electronic devices demands products with high performance and efficiency. Suc...
The study addresses how surface nanostructuring of AISI 304 stainless steel (SS) by surface mechanic...
Due to copyright restrictions, the access to the full text of this article is only available via sub...
Due to copyright restrictions, the access to the full text of this article is only available via sub...
Due to copyright restrictions, the access to the full text of this article is only available via sub...
Due to copyright restrictions, the access to the full text of this article is only available via sub...
Polishing technology has been broadly used in manufacturing of components to enhance the surface qua...
Due to copyright restrictions, the access to the full text of this article is only available via sub...
Recently, the rapid increase in the number of metallization layers in microelectronic devices couple...
Chemical-Mechanical-Polishing (CMP), first used as a planarization technology in the manufacture of ...
Chemical Mechanical Planarization (CMP) has emerged as the central technology for polishing wafers i...
Chemical-Mechanical Polishing (CMP) has emerged as an enabling technology for manufacturing multi-le...
Modern material demands are intricate, necessitating high-strength similar to steels and chemical in...
This paper provides a tribochemical study of the selective layer surface by chemical mechanical plan...
The essential parts of interconnects for silicon based logic and memory devices consist of metal wir...
Increasing reliance on electronic devices demands products with high performance and efficiency. Suc...
The study addresses how surface nanostructuring of AISI 304 stainless steel (SS) by surface mechanic...
Due to copyright restrictions, the access to the full text of this article is only available via sub...
Due to copyright restrictions, the access to the full text of this article is only available via sub...
Due to copyright restrictions, the access to the full text of this article is only available via sub...
Due to copyright restrictions, the access to the full text of this article is only available via sub...
Polishing technology has been broadly used in manufacturing of components to enhance the surface qua...
Due to copyright restrictions, the access to the full text of this article is only available via sub...
Recently, the rapid increase in the number of metallization layers in microelectronic devices couple...
Chemical-Mechanical-Polishing (CMP), first used as a planarization technology in the manufacture of ...
Chemical Mechanical Planarization (CMP) has emerged as the central technology for polishing wafers i...
Chemical-Mechanical Polishing (CMP) has emerged as an enabling technology for manufacturing multi-le...
Modern material demands are intricate, necessitating high-strength similar to steels and chemical in...
This paper provides a tribochemical study of the selective layer surface by chemical mechanical plan...
The essential parts of interconnects for silicon based logic and memory devices consist of metal wir...
Increasing reliance on electronic devices demands products with high performance and efficiency. Suc...
The study addresses how surface nanostructuring of AISI 304 stainless steel (SS) by surface mechanic...
Due to copyright restrictions, the access to the full text of this article is only available via sub...