The authors gratefully acknowledge the financial support of the Slovak Grant Agency under the Contracts VEGA 2/6160/26 and 2/0111/11. This work was also supported by the Slovak Research and Development Agency under the Contracts APVV-0102-07, APVV-0076-11, APVV-0492-11 and APVV-SK-UA-0043-09 and by CEX FUN-MAT. V.S. gratefully acknowledges the fellowship of the Slovak Academic Information Agency. This research contributes to the European COST Action MP0602 on Advanced Solder Materials for High Temperature Applications.The effect of silver content on structure and properties of Sn100-xBi10Agx (x=3-10 at%) lead-free solder and Cu-solder-Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon for...
This work investigates the effect of bismuth (Bi) addition, 1 wt% Bi, on wettability of the Sn-3.0Ag...
With the very high rate of introducing new designs, the service lives of modern electronic devices h...
In this study, we investigated the microstructure, mechanical properties, and thermal performance of...
The authors gratefully acknowledge the financial support of the Slovak Grant Agency under the Contra...
Detailed studies to characterize the microstructural development and mechanical properties of eutect...
Detailed studies to characterize the microstructural development and mechanical properties of eutect...
Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joint
Lead free solders are expected to replace the traditional Sn-Pb alloys due to environmental concern....
The interfacial reaction between Sn–36Pb–2Ag (numbers are all in mass % unless specified otherwise) ...
Because of the environmental health implications of Pb, and legislation backing Restriction on Hazar...
The transition to lead-free soldering for the electronic industry has been necessitated by the healt...
Low-Ag Sn-Ag-Cu (SAC) alloys such as Sn-1 wt.%Ag-0.5 wt.% Cu (SAC105) have been considered as a solu...
Cu–(Sn37Pb) and Cu–(Sn3.5Ag0.5Cu) solder joints were prepared at the same reflow temperature of 230 ...
With the very high rate of introducing new designs, the service lives of modern electronic devices h...
Three distinct approaches were investigated in the development of new high and low temperature lead-...
This work investigates the effect of bismuth (Bi) addition, 1 wt% Bi, on wettability of the Sn-3.0Ag...
With the very high rate of introducing new designs, the service lives of modern electronic devices h...
In this study, we investigated the microstructure, mechanical properties, and thermal performance of...
The authors gratefully acknowledge the financial support of the Slovak Grant Agency under the Contra...
Detailed studies to characterize the microstructural development and mechanical properties of eutect...
Detailed studies to characterize the microstructural development and mechanical properties of eutect...
Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joint
Lead free solders are expected to replace the traditional Sn-Pb alloys due to environmental concern....
The interfacial reaction between Sn–36Pb–2Ag (numbers are all in mass % unless specified otherwise) ...
Because of the environmental health implications of Pb, and legislation backing Restriction on Hazar...
The transition to lead-free soldering for the electronic industry has been necessitated by the healt...
Low-Ag Sn-Ag-Cu (SAC) alloys such as Sn-1 wt.%Ag-0.5 wt.% Cu (SAC105) have been considered as a solu...
Cu–(Sn37Pb) and Cu–(Sn3.5Ag0.5Cu) solder joints were prepared at the same reflow temperature of 230 ...
With the very high rate of introducing new designs, the service lives of modern electronic devices h...
Three distinct approaches were investigated in the development of new high and low temperature lead-...
This work investigates the effect of bismuth (Bi) addition, 1 wt% Bi, on wettability of the Sn-3.0Ag...
With the very high rate of introducing new designs, the service lives of modern electronic devices h...
In this study, we investigated the microstructure, mechanical properties, and thermal performance of...