Laser welding of dissimilar materials is challenging, due to their difference in coefficients of thermal expansion (CTE). In this work, fused silica-to-sapphire joints were achieved by employment of a ns laser focused in the intermediate Si-enriched fresnoitic glass thin film sealant. The microstructure of the bonded interphase was analyzed down to the nanometer scale and related to the laser parameters used. The crystallization of fresnoite in the glass sealant upon laser process leads to an intense blue emission intensity under UV excitation. This crystallization is favored in the interphase with the silica glass substrate, rather than in the border with the sapphire. The formation of SiO2 particles was confirmed, as well. The bond qualit...
The direct wafer bonding technology is applied to join glass substrates for optical devices in high ...
We report on the welding of fused silica with bursts of ultrashort laser pulses. By optimizing the b...
A novel method for bonding micro optical components using a new joining process of silicon with glas...
The laser welding of two fused silica substrates using a fresnoitic glass thin film as a sealant by ...
Two sapphire substrates are tightly bonded through a fresnoite-glass thin film, by irradiation with ...
Two sapphire substrates were bonded using a fresnoite glass thin film as a sealant, by irradiation w...
This paper embraces two different approaches for the joining of materials through glass sealants. Fi...
This work reports on laser welding of two 1 mm thickness borosilicate glasses through the irradiatio...
We report on the welding of various glasses with ultrashort laser pulses. Femtosecond laser pulses a...
We report on the joining of different glass types with dissimilar optical, thermal and mechanical pr...
Devices consisting of glass and metal are widely applied to many fields. With the miniaturisation an...
Abstract. A pioneering procedure for substance-to-substance joining of quartz glass is described. Di...
The realization of stable bonds between different glasses has attracted a lot interest in recent yea...
New joining techniques are required for the variety of materials used in the manufacture of microsys...
The welding of transparent materials with ultrashort laser pulse at high repetition rates has attrac...
The direct wafer bonding technology is applied to join glass substrates for optical devices in high ...
We report on the welding of fused silica with bursts of ultrashort laser pulses. By optimizing the b...
A novel method for bonding micro optical components using a new joining process of silicon with glas...
The laser welding of two fused silica substrates using a fresnoitic glass thin film as a sealant by ...
Two sapphire substrates are tightly bonded through a fresnoite-glass thin film, by irradiation with ...
Two sapphire substrates were bonded using a fresnoite glass thin film as a sealant, by irradiation w...
This paper embraces two different approaches for the joining of materials through glass sealants. Fi...
This work reports on laser welding of two 1 mm thickness borosilicate glasses through the irradiatio...
We report on the welding of various glasses with ultrashort laser pulses. Femtosecond laser pulses a...
We report on the joining of different glass types with dissimilar optical, thermal and mechanical pr...
Devices consisting of glass and metal are widely applied to many fields. With the miniaturisation an...
Abstract. A pioneering procedure for substance-to-substance joining of quartz glass is described. Di...
The realization of stable bonds between different glasses has attracted a lot interest in recent yea...
New joining techniques are required for the variety of materials used in the manufacture of microsys...
The welding of transparent materials with ultrashort laser pulse at high repetition rates has attrac...
The direct wafer bonding technology is applied to join glass substrates for optical devices in high ...
We report on the welding of fused silica with bursts of ultrashort laser pulses. By optimizing the b...
A novel method for bonding micro optical components using a new joining process of silicon with glas...