A system and method are provided for fabricating a low electric resistance ohmic contact, or interface, between a Carbon Nanotube (CNT) and a desired node on a substrate. In one embodiment, the CNT is a Multiwalled, or Multiwall, Carbon Nanotube (MWCNT), and the interface provides a low electric resistance ohmic contact between all conduction shells, or at least a majority of conduction shells, of the MWCNT and the desired node on the substrate. In one embodiment, a Focused Electron Beam Chemical Vapor Deposition (FEB-CVD) process is used to deposit an interface material near an exposed end of the MWCNT in such a manner that surface diffusion of precursor molecules used in the FEB-CVD process induces lateral spread of the deposited interfac...
We demonstrate a simple method that uses a scanning electron microscope for making a reliable low re...
Nanoelectromechanical systems (NEMS) are a rapidly growing area of research. We discuss here the fab...
As the downward scaling of integrated circuits continues, the problem of electromigration in copper ...
A system and method are provided for fabricating a low electric resistance ohmic contact, or interfa...
Evaluating the electrical nature of carbon nanotubes (CNTs) from a collection requires establishing ...
We have fabricated electrical devices based on thermal chemical vapor deposition (TCVD) grown single...
Electron-beam-induced deposited-tungsten (EBID-W) technique is used to fabricate contacts for carbon...
This thesis concerns development and characterization of the FEBID technique to improve interfacial ...
International audienceA bio-inspired method involving the deposition of a carbon nanolayer after the...
International audienceA bio-inspired method involving the deposition of a carbon nanolayer after the...
We discuss the use of electron-shading effect during the plasma-enhanced chemical vapor deposition t...
Electron beam induced carbonaceous deposition has been carried out in the presence of water vapor at...
Focused ion beam (FIB) techniques have found many applications in nanoscience and nanotechnology app...
Focused ion beam (FIB) techniques have found many applications in nanoscience and nanotechnology app...
Focused ion beam (FIB) techniques have found many applications in nanoscience and nanotechnology app...
We demonstrate a simple method that uses a scanning electron microscope for making a reliable low re...
Nanoelectromechanical systems (NEMS) are a rapidly growing area of research. We discuss here the fab...
As the downward scaling of integrated circuits continues, the problem of electromigration in copper ...
A system and method are provided for fabricating a low electric resistance ohmic contact, or interfa...
Evaluating the electrical nature of carbon nanotubes (CNTs) from a collection requires establishing ...
We have fabricated electrical devices based on thermal chemical vapor deposition (TCVD) grown single...
Electron-beam-induced deposited-tungsten (EBID-W) technique is used to fabricate contacts for carbon...
This thesis concerns development and characterization of the FEBID technique to improve interfacial ...
International audienceA bio-inspired method involving the deposition of a carbon nanolayer after the...
International audienceA bio-inspired method involving the deposition of a carbon nanolayer after the...
We discuss the use of electron-shading effect during the plasma-enhanced chemical vapor deposition t...
Electron beam induced carbonaceous deposition has been carried out in the presence of water vapor at...
Focused ion beam (FIB) techniques have found many applications in nanoscience and nanotechnology app...
Focused ion beam (FIB) techniques have found many applications in nanoscience and nanotechnology app...
Focused ion beam (FIB) techniques have found many applications in nanoscience and nanotechnology app...
We demonstrate a simple method that uses a scanning electron microscope for making a reliable low re...
Nanoelectromechanical systems (NEMS) are a rapidly growing area of research. We discuss here the fab...
As the downward scaling of integrated circuits continues, the problem of electromigration in copper ...