Methods are provided for fabricating three-dimensional electrically conductive structures. Three-dimensional electrically conductive microstructures are also provided. The method may include providing a mold having at least one microdepression which defines a three-dimensional structure; filling the microdepression of the mold with at least one substrate material; molding the at least one substrate material to form a substrate; and depositing and patterning of at least one electrically conductive layer either during the molding process or subsequent to the molding process to form an electrically conductive structure. In one embodiment, the three-dimensional electrically conductive microstructure comprises an electrically functional micronee...
The invention relates to a process for the production of a three-dimensional component or a componen...
專利國別:美國United States Patent: 6,221,227Application number: 09/454,066國際分類號:C25D 1/00; C25D 1/20; C25D...
A new process for realising three dimensional microstructures is presented. Using an UV lithographic...
The invention concerns a method for making a suspended microstructure comprising the following steps...
Techniques for forming a three dimensional (3D) feature on a substrate are disclosed. In one exempla...
US 6,251,248 B1USA109/4220922001/06/26A microfabrication process for making a microstructure product...
The subject of the invention is a process for fabricating at least one elementary heterostructure co...
Abstract of WO 9411788 (A1) The invention relates to method of providing a microstructure in electri...
A method for fabricating a three-dimensional (3D) polymeric microstructure is disclosed. The method ...
A combination of metal-attractive and metal-resistant polymers en-ables selective deposition of meta...
A new microfabrication technology capable of electro-depositing truly three dimensional metal micro-...
There is growing interest in the development of fabrication techniques to cost effectively mass-prod...
In one embodiment, a method for fabricating a metal microstructure includes forming a non-conductive...
The ability to generate a large area micropillar array with spatially varying heights allows for exp...
US 6,221,227 B1USA109/454,066A microfabrication process comprises the swelling of at least a hydroph...
The invention relates to a process for the production of a three-dimensional component or a componen...
專利國別:美國United States Patent: 6,221,227Application number: 09/454,066國際分類號:C25D 1/00; C25D 1/20; C25D...
A new process for realising three dimensional microstructures is presented. Using an UV lithographic...
The invention concerns a method for making a suspended microstructure comprising the following steps...
Techniques for forming a three dimensional (3D) feature on a substrate are disclosed. In one exempla...
US 6,251,248 B1USA109/4220922001/06/26A microfabrication process for making a microstructure product...
The subject of the invention is a process for fabricating at least one elementary heterostructure co...
Abstract of WO 9411788 (A1) The invention relates to method of providing a microstructure in electri...
A method for fabricating a three-dimensional (3D) polymeric microstructure is disclosed. The method ...
A combination of metal-attractive and metal-resistant polymers en-ables selective deposition of meta...
A new microfabrication technology capable of electro-depositing truly three dimensional metal micro-...
There is growing interest in the development of fabrication techniques to cost effectively mass-prod...
In one embodiment, a method for fabricating a metal microstructure includes forming a non-conductive...
The ability to generate a large area micropillar array with spatially varying heights allows for exp...
US 6,221,227 B1USA109/454,066A microfabrication process comprises the swelling of at least a hydroph...
The invention relates to a process for the production of a three-dimensional component or a componen...
專利國別:美國United States Patent: 6,221,227Application number: 09/454,066國際分類號:C25D 1/00; C25D 1/20; C25D...
A new process for realising three dimensional microstructures is presented. Using an UV lithographic...