The Double Cantilever Beam (DCB) test is the most widely used measurement technique for Mode I interlaminar fracture toughness of composite structures. However, the traditional testing methodology is based on the optical tracking of hand-marked scales on the specimen edge, which reduces its accuracy and makes it particularly dependent on human skills. Here, we present a novel Top Surface Analysis (TSA) method which overcomes these difficulties by analysing the top surface of DCB test samples via Digital Image Correlation. The automated measuring and data analysis procedure minimise the influence of human errors. This approach is able to simultaneously measure crack length and crack tip opening displacement. In order to verify the accuracy o...
The subsurface nature of Crack Tip Opening Displacement (CTOD) makes its direct measurement very dif...
Delamination is one of the important modes of failure in laminated composite materials. In this resp...
Digital image correlation has been used, in conjunction with Mode I and Mode II fracture mechanics t...
This study aims to develop a novel approach to characterizing fracture parameters of cracked structu...
One of the main challenges in experimental fracture mechanics is to correctly estimate fracture para...
A combined numerical-experimental methodology is presented to measure dynamic Mode-I fracture proper...
A combined numerical-experimental methodology is presented to measure dynamic Mode-I fracture proper...
The measurement of the fracture toughness of fiber reinforced composites at high rates of loading is...
The mode I and mode II fracture toughness and the critical strain energy release rate for different ...
thesisStandardized tests exist for measuring the Mode I and Mode II interlaminar fracture toughness ...
In this paper the results of an experimental investigation on the effect of subcritical damage on th...
Interface fracture mechanics is one of the main focuses of electronics reliability research. Determi...
Delamination between the copper leadframe and the epoxy molding compound of microelectronic devices ...
The experimental measurement of fracture toughness and crack driving force are the main steps for th...
In this study, the crack lengths in adhesively bonded double cantilever beam (DCB) test specimens ha...
The subsurface nature of Crack Tip Opening Displacement (CTOD) makes its direct measurement very dif...
Delamination is one of the important modes of failure in laminated composite materials. In this resp...
Digital image correlation has been used, in conjunction with Mode I and Mode II fracture mechanics t...
This study aims to develop a novel approach to characterizing fracture parameters of cracked structu...
One of the main challenges in experimental fracture mechanics is to correctly estimate fracture para...
A combined numerical-experimental methodology is presented to measure dynamic Mode-I fracture proper...
A combined numerical-experimental methodology is presented to measure dynamic Mode-I fracture proper...
The measurement of the fracture toughness of fiber reinforced composites at high rates of loading is...
The mode I and mode II fracture toughness and the critical strain energy release rate for different ...
thesisStandardized tests exist for measuring the Mode I and Mode II interlaminar fracture toughness ...
In this paper the results of an experimental investigation on the effect of subcritical damage on th...
Interface fracture mechanics is one of the main focuses of electronics reliability research. Determi...
Delamination between the copper leadframe and the epoxy molding compound of microelectronic devices ...
The experimental measurement of fracture toughness and crack driving force are the main steps for th...
In this study, the crack lengths in adhesively bonded double cantilever beam (DCB) test specimens ha...
The subsurface nature of Crack Tip Opening Displacement (CTOD) makes its direct measurement very dif...
Delamination is one of the important modes of failure in laminated composite materials. In this resp...
Digital image correlation has been used, in conjunction with Mode I and Mode II fracture mechanics t...