This paper examines the process of anodic bonding with regard to the fabrication of silicon-glass capacitive sensors. Various glasses are assessed in terms of the suitability of their physical properties and results are presented on flatness control of these glasses when bonded to silicon at different temperatures. Many of the problems which can typically affect silicon-glass sensors are examined and explained in terms of the anodic bonding process. Effects such as the electrolysis of the glass and the transport of the oxygen produced in this process are discussed and design considerations for minimising deleterious effects of this oxygen are presented. We demonstrate the process of selection of glass, bonding parameters and other material ...
Glass-to-glass wafer bonding has recently attracted considerable interest. Especially for liquid man...
In this paper, Ti-Glass anodic bonding is investigated on both chip and wafer level. In concern of c...
This master thesis deals with the technology anodic soldering. It focuses mainly on soldering sandwi...
This paper reports a silicon-silicon anodic bonding process based on embedded glass. We successfully...
This paper provides a method for the anodic bonding of SOI and glass wafers, and it explains the bon...
Wafer bonding is an enabling technology in substrate engineering, MEMS manufacturing and packaging a...
The article deals with a novel laboratory anodic bonding device. This device is used for MEMS creati...
By MEMS packaging test platform for bonding process of bonding temperature and bonding time,and test...
The use of borosilicate glass for anodic wafer bonding to silicon is well established in industry. I...
New investigations were carried out in order to characterise the anodic bonding behaviour of borosil...
A novel method for joining silicon and glass wafers with laser radiation is described. In order to c...
A new, nondestructive anodic bonding test has been designed. One main factor involved in the anodic ...
The work presented in this paper deals with the bonding of small structures, down to 1 mu m. Its aim...
In the present work, an intermediate sodium-rich glass layer was deposited on silicon wafer by a PVD...
Glass-to-glass wafer bonding has recently attracted considerable interest. Especially for liquid man...
Glass-to-glass wafer bonding has recently attracted considerable interest. Especially for liquid man...
In this paper, Ti-Glass anodic bonding is investigated on both chip and wafer level. In concern of c...
This master thesis deals with the technology anodic soldering. It focuses mainly on soldering sandwi...
This paper reports a silicon-silicon anodic bonding process based on embedded glass. We successfully...
This paper provides a method for the anodic bonding of SOI and glass wafers, and it explains the bon...
Wafer bonding is an enabling technology in substrate engineering, MEMS manufacturing and packaging a...
The article deals with a novel laboratory anodic bonding device. This device is used for MEMS creati...
By MEMS packaging test platform for bonding process of bonding temperature and bonding time,and test...
The use of borosilicate glass for anodic wafer bonding to silicon is well established in industry. I...
New investigations were carried out in order to characterise the anodic bonding behaviour of borosil...
A novel method for joining silicon and glass wafers with laser radiation is described. In order to c...
A new, nondestructive anodic bonding test has been designed. One main factor involved in the anodic ...
The work presented in this paper deals with the bonding of small structures, down to 1 mu m. Its aim...
In the present work, an intermediate sodium-rich glass layer was deposited on silicon wafer by a PVD...
Glass-to-glass wafer bonding has recently attracted considerable interest. Especially for liquid man...
Glass-to-glass wafer bonding has recently attracted considerable interest. Especially for liquid man...
In this paper, Ti-Glass anodic bonding is investigated on both chip and wafer level. In concern of c...
This master thesis deals with the technology anodic soldering. It focuses mainly on soldering sandwi...