AbstractThe performance of prototype active-edge VTT sensors bump-bonded to the Timepix ASIC is presented. Non-irradiated sensors of thicknesses 100–200μm and pixel-to-edge distances of 50μm and 100μm were probed with a beam of charged hadrons with sub-pixel precision using the Timepix telescope assembled at the SPS at CERN. The sensors are shown to be highly efficient up to a few micrometers from the physical edge of the sensor. The distortion of the electric field lines at the edge of the sensors is studied by reconstructing the streamlines of the electric field using two-pixel clusters. These results are supported by TCAD simulations. The reconstructed streamlines are used to study the field distortion as a function of the bias voltage a...
We present the results of the characterization of silicon pixel modules employing n-in-p planar sens...
AbstractThe edge surfaces of single crystal CdTe play an important role in the electronic properties...
In this thesis work the results of the characterizations of the 3D-trench TimeSPOT silicon sensors w...
The performance of prototype active-edge VTT sensors bump-bonded to the Timepix ASIC is presented. N...
AbstractThe performance of prototype active-edge VTT sensors bump-bonded to the Timepix ASIC is pres...
Silicon sensor technologies with reduced dead area at the sensor's perimeter are under development a...
Silicon micropattern devices are crucial components of detector systems designed to study decays of ...
AbstractDuring the past five years VTT has actively developed fabrication processes for the state-of...
The development of n-on-p "edgeless" planar pixel sensors being fabricated at FBK (Trento, Italy), a...
Active edge p-on-p silicon pixel detectors with thickness of 100μm were fabricated on 150 mm float z...
3D detectors and devices with an ‘active edge’ were fabricated at the Stanford Nanofabrication Facil...
The silicon pixel vertex detector is a key element of the BTeV spectrometer. Sensors bump-bonded to ...
To cope with the High Luminosity LHC harsh conditions, the ATLAS inner tracker has to be upgraded to...
The development of n-on-p "edgeless" planar pixel sensors being fabricated at FBK (Trento, Italy), a...
The Vertex Locator (VELO) detector is a silicon strip detector that surrounds the proton-proton inte...
We present the results of the characterization of silicon pixel modules employing n-in-p planar sens...
AbstractThe edge surfaces of single crystal CdTe play an important role in the electronic properties...
In this thesis work the results of the characterizations of the 3D-trench TimeSPOT silicon sensors w...
The performance of prototype active-edge VTT sensors bump-bonded to the Timepix ASIC is presented. N...
AbstractThe performance of prototype active-edge VTT sensors bump-bonded to the Timepix ASIC is pres...
Silicon sensor technologies with reduced dead area at the sensor's perimeter are under development a...
Silicon micropattern devices are crucial components of detector systems designed to study decays of ...
AbstractDuring the past five years VTT has actively developed fabrication processes for the state-of...
The development of n-on-p "edgeless" planar pixel sensors being fabricated at FBK (Trento, Italy), a...
Active edge p-on-p silicon pixel detectors with thickness of 100μm were fabricated on 150 mm float z...
3D detectors and devices with an ‘active edge’ were fabricated at the Stanford Nanofabrication Facil...
The silicon pixel vertex detector is a key element of the BTeV spectrometer. Sensors bump-bonded to ...
To cope with the High Luminosity LHC harsh conditions, the ATLAS inner tracker has to be upgraded to...
The development of n-on-p "edgeless" planar pixel sensors being fabricated at FBK (Trento, Italy), a...
The Vertex Locator (VELO) detector is a silicon strip detector that surrounds the proton-proton inte...
We present the results of the characterization of silicon pixel modules employing n-in-p planar sens...
AbstractThe edge surfaces of single crystal CdTe play an important role in the electronic properties...
In this thesis work the results of the characterizations of the 3D-trench TimeSPOT silicon sensors w...