Silicone encapsulation of the piezoresistive composite element as a low-cost packaging for measuring high-pressure

AbstractThis paper presents various silicone encapsulations of the novel high-pressure composite element. Measurements at 100MPa (1 000bar or 14 500 psi) for different setups have been carried out successfully. The sensitivity of the softest truncated-cone-like encapsulated setup is nearly not reduced at 100MPa, while the sensitivity of the harder encapsulations is reduced by 2% respectively 4% compared to the bare composite element