AbstractThe hot deformation behavior and microstructure evolution of a corrosion resistant Fe-Ni base superalloy named as Alloy 825 were investigated by means of hot physical simulation on Gleeble-1500. The properties of flow curves were analyzed, and constitutive equation for 825 alloy was established. Then optical microscope was used to analyze dynamic recrystallization (DRX) behavior during hot working process. A finite element software MSC.Superform was used to simulate the hot extrusion process of typical pipes for this alloy. The results showed that extrusion speed and billet temperature were the main factors to influence the hot extrusion deforming resistance, and the acceptable extrusion parameters for Alloy 825 may be in the range ...
AbstractDispersion strengthened copper alloys (DSC) with high strength and high conductivity are wid...
AbstractThe Mn-Zn ferrite powders were prepared by refluxing method using the leaching liquid of hig...
AbstractEncapsulation materials are very vital to the power light emitting diode packaging and becom...
AbstractThe flow stress behaviors and microstructure characteristics of C-276 alloy were investigate...
AbstractTiO2/graphene composite photocatalysts were fabricated and the photocatalytic hydrogen-gener...
AbstractThe TiO2 samples and samples of TiO2 doped with Fe was prepared by sol-gel method with tetra...
AbstractEffect of pre-deformation on corrosion behavior of AISI 304 stainless steel was investigated...
AbstractThe oxidation behavior of a superalloy with the chemical composition (wt.%) of Al 5.5-Ti 2.6...
AbstractpH sensor based on a gateless AlGaN/GaN high electron mobility transistor (HEMT) structure i...
AbstractA new-type Mn-Ni damping alloy named Mn 40 with the Mn content of 40wt% was developed. The X...
AbstractAl-based amorphous ribbons have been prepared by the melt-spin method, and the amorphous com...
AbstractStarting from elemental In and Se powders, polycrystalline In4Se3 compound samples were synt...
AbstractThe hot forging deformation experiments of a new type high performance powder metallurgy (P/...
AbstractIn this paper, natural flake graphite was treated by mild oxidation and carbon coating techn...
AbstractPolycrystal FeGa alloy rods were prepared by vacuum induction melting furnace. Magnetostrict...
AbstractDispersion strengthened copper alloys (DSC) with high strength and high conductivity are wid...
AbstractThe Mn-Zn ferrite powders were prepared by refluxing method using the leaching liquid of hig...
AbstractEncapsulation materials are very vital to the power light emitting diode packaging and becom...
AbstractThe flow stress behaviors and microstructure characteristics of C-276 alloy were investigate...
AbstractTiO2/graphene composite photocatalysts were fabricated and the photocatalytic hydrogen-gener...
AbstractThe TiO2 samples and samples of TiO2 doped with Fe was prepared by sol-gel method with tetra...
AbstractEffect of pre-deformation on corrosion behavior of AISI 304 stainless steel was investigated...
AbstractThe oxidation behavior of a superalloy with the chemical composition (wt.%) of Al 5.5-Ti 2.6...
AbstractpH sensor based on a gateless AlGaN/GaN high electron mobility transistor (HEMT) structure i...
AbstractA new-type Mn-Ni damping alloy named Mn 40 with the Mn content of 40wt% was developed. The X...
AbstractAl-based amorphous ribbons have been prepared by the melt-spin method, and the amorphous com...
AbstractStarting from elemental In and Se powders, polycrystalline In4Se3 compound samples were synt...
AbstractThe hot forging deformation experiments of a new type high performance powder metallurgy (P/...
AbstractIn this paper, natural flake graphite was treated by mild oxidation and carbon coating techn...
AbstractPolycrystal FeGa alloy rods were prepared by vacuum induction melting furnace. Magnetostrict...
AbstractDispersion strengthened copper alloys (DSC) with high strength and high conductivity are wid...
AbstractThe Mn-Zn ferrite powders were prepared by refluxing method using the leaching liquid of hig...
AbstractEncapsulation materials are very vital to the power light emitting diode packaging and becom...