MEMS silicon-based micro-evaporator with diamond-shaped fins

AbstractA new design of micro-evaporators, with 45 channels (100μm deep) and diamond-shaped fins (40μm wide, 160μm long, 20μm separation), is fabricated by anodic bonding of silicon and glass wafers, in a five masks process. This new design improves stability of the working conditions, and has a localized hot zone in the main part of the device. The measured absorbed heat includes the energy that heats up the coolant (water) from 25 to 100∘C (roughly 300 J/g) and the latent heat of evaporation (2400 J/g). The latter one is a dominant term, and heat absorption is significantly increased at fin temperatures above the water boiling point