A 3D FEM Model for Heat Transfer Mechanisms in Membrane Based Thermal Conductivity Sensors Developed Using SOI CMOS MEMS Technology

AbstractThis paper presents an experimentally verified 3D FEM model to understand heat transfer mechanisms in membrane based thermal conductivity sensors developed using SOI CMOS MEMS technology. It aims to provide a structured methodology to design micro thermal conductivity sensors for gas detection. The reported model takes in to account heat transfer by conduction and convection in conjunction with device geometry and is based on a sensor fabricated at a commercial CMOS foundry using a 1μm process that measures only 1x1 mm2