AbstractThis paper represents a further contribution to the study of identification procedures for material mechanics resting on kinematic measurements provided by 2D Digital Image Correlation (DIC) at the microscale. Reference is made to non-conventional experiments on adhesively bonded assemblies industrially manufactured for aerospace applications. For calibration purposes a local approach is considered under plane stress conditions, focusing on a small sub-domain on the sample surface, in which mixed mode debonding is monitored. As a novelty, both the (cohesive) mechanical parameters of the interface and the actual boundary conditions prescribed at different time instants during the test are considered as unknowns to be estimated on the...