AbstractSelf-assembly is the spontaneous and reversible organization of components into ordered structures, representing an alternative to the conventional manufacture of systems made of components from milli to nano scales. First commercial applications of self-assembly have appeared in recent years, for example in the fabrication of radio frequency identification (RFID) tags. However, the full impact of this new approach towards heterogeneous system integration will only be realized once self-assembly can be programmed on demand. A key concept is the “programmable surface” – an interface whose properties can be controlled with high spatial and temporal resolution. Several crucial topics are discussed: real time control of interfacial prop...
Most solid freeform fabrication (SFF) manufacturing processes assemble uniform components such as po...
Abstract—Challenges facing the scaling of microelectronics to sub-50 nm dimensions and the demanding...
Abstract—Challenges facing the scaling of microelectronics to sub-50 nm dimensions and the demanding...
AbstractSelf-assembly is the spontaneous and reversible organization of components into ordered stru...
Steady progress in understanding and implementation are establishing self-assembly as a versatile, p...
Abstract — Future MEMS systems will be composed of larger varieties of devices with very different f...
The design and fabrication techniques for microelectromechanical systems (MEMS) and nanodevices are ...
International audienceMICROELECTRONICS brought an information revolution through integrating a vast ...
International audienceMICROELECTRONICS brought an information revolution through integrating a vast ...
Thesis (Ph.D.)--University of Washington, 2014This dissertation studies and improves upon template-b...
This publication provides an overview and discusses some challenges of surface tension directed flui...
This publication provides an overview and discusses some challenges of surface tension directed flui...
This publication provides an overview and discusses some challenges of surface tension directed flui...
International audienceMICROELECTRONICS brought an information revolution through integrating a vast ...
Most solid freeform fabrication (SFF) manufacturing processes assemble uniform components such as p...
Most solid freeform fabrication (SFF) manufacturing processes assemble uniform components such as po...
Abstract—Challenges facing the scaling of microelectronics to sub-50 nm dimensions and the demanding...
Abstract—Challenges facing the scaling of microelectronics to sub-50 nm dimensions and the demanding...
AbstractSelf-assembly is the spontaneous and reversible organization of components into ordered stru...
Steady progress in understanding and implementation are establishing self-assembly as a versatile, p...
Abstract — Future MEMS systems will be composed of larger varieties of devices with very different f...
The design and fabrication techniques for microelectromechanical systems (MEMS) and nanodevices are ...
International audienceMICROELECTRONICS brought an information revolution through integrating a vast ...
International audienceMICROELECTRONICS brought an information revolution through integrating a vast ...
Thesis (Ph.D.)--University of Washington, 2014This dissertation studies and improves upon template-b...
This publication provides an overview and discusses some challenges of surface tension directed flui...
This publication provides an overview and discusses some challenges of surface tension directed flui...
This publication provides an overview and discusses some challenges of surface tension directed flui...
International audienceMICROELECTRONICS brought an information revolution through integrating a vast ...
Most solid freeform fabrication (SFF) manufacturing processes assemble uniform components such as p...
Most solid freeform fabrication (SFF) manufacturing processes assemble uniform components such as po...
Abstract—Challenges facing the scaling of microelectronics to sub-50 nm dimensions and the demanding...
Abstract—Challenges facing the scaling of microelectronics to sub-50 nm dimensions and the demanding...