AbstractIn this paper, the optimization of the cooling performance of a rectangular microchannel heat sink is investigated with four different gaseous coolants; air, ammonia gas, dichlorodifluoromethane (R-12) and chlorofluoromethane (R-22). A systematic robust thermal resistance model together with a methodical pumping power calculation is used to formulate the objective functions, the thermal resistance and pumping power. The non-dominated sorting genetic algorithm (NSGA-II), a multi-objective algorithm, is applied in the optimization procedure. The optimized thermal resistances obtained are 0.178, 0.14, 0.08 and 0.133°K/W for the pumping powers of 6.4, 4, 22.4 and 16.5W for air, ammonia gas, R-12 and R-22, respectively. These results sho...
The microchannel heat sink (MCHS) has been established as an effective heat removal system in electr...
During the last three decades the concept of the traditional cooling systems was modified to include...
The usage of a very large scale integrated circuits generate high heat fluxes and require an effecti...
In this paper, the optimization of the cooling performance of a rectangular microchannel heat sink i...
AbstractIn this paper, the optimization of the cooling performance of a rectangular microchannel hea...
The minimization of integrated circuits in powerful electronic devices generates a large amount of h...
AbstractMinimization of the thermal resistance and pressure drop of a microchannel heat sink is desi...
AbstractMinimization of the thermal resistance and pressure drop of a microchannel heat sink is desi...
Minimization of the thermal resistance and pressure drop of a microchannel heat sink is desirable fo...
The increased global demands for the minimization of integrated circuits used in electronic devices ...
Cooling of electronic devices is problematic by its nature simply because of the space restriction. ...
The usage of a very large scale integrated circuits generate high heat fluxes and require an effecti...
The usage of a very large scale integrated circuits generate high heat fluxes and require an effecti...
The optimization of a nanofluid-cooled rectangular microchannel heat sink is reported. Two nanofl...
In this paper, the thermal and hydrodynamic performances of an aqueous ammonia base-nanofluid (Al2O3...
The microchannel heat sink (MCHS) has been established as an effective heat removal system in electr...
During the last three decades the concept of the traditional cooling systems was modified to include...
The usage of a very large scale integrated circuits generate high heat fluxes and require an effecti...
In this paper, the optimization of the cooling performance of a rectangular microchannel heat sink i...
AbstractIn this paper, the optimization of the cooling performance of a rectangular microchannel hea...
The minimization of integrated circuits in powerful electronic devices generates a large amount of h...
AbstractMinimization of the thermal resistance and pressure drop of a microchannel heat sink is desi...
AbstractMinimization of the thermal resistance and pressure drop of a microchannel heat sink is desi...
Minimization of the thermal resistance and pressure drop of a microchannel heat sink is desirable fo...
The increased global demands for the minimization of integrated circuits used in electronic devices ...
Cooling of electronic devices is problematic by its nature simply because of the space restriction. ...
The usage of a very large scale integrated circuits generate high heat fluxes and require an effecti...
The usage of a very large scale integrated circuits generate high heat fluxes and require an effecti...
The optimization of a nanofluid-cooled rectangular microchannel heat sink is reported. Two nanofl...
In this paper, the thermal and hydrodynamic performances of an aqueous ammonia base-nanofluid (Al2O3...
The microchannel heat sink (MCHS) has been established as an effective heat removal system in electr...
During the last three decades the concept of the traditional cooling systems was modified to include...
The usage of a very large scale integrated circuits generate high heat fluxes and require an effecti...