AbstractThe stability of microstructure and mechanical property in Ni3Al-Mo based single-crystal superalloy aged at 1100°C for long time was investigated. The grown-dynamic law of γ strengthening phase and strengthening mechanism of the alloy were discussed deeply. The observation of microstructure and analysis of composition were conducted by using Scan Electron Microscope (SEM) with Electron Probe (EPMA/EDS) and the size of the phase was measured by quantitative metallographic technology. The experimental results showed that there were some short rod-like Y-(Ni,Re)Mo particles precipitated in the alloy aged at 1100°C for 100h and some needle-like Y-(Ni,Re)Mo particles fromed in the alloy aged at 1100°C for more than 250h. The amount and s...
AbstractThe TiO2 samples and samples of TiO2 doped with Fe was prepared by sol-gel method with tetra...
AbstractWith different concentration of H3PW12O40•xH2O, conducting polyaniline (PANI) was synthesize...
In this study, the white light emitting diodes (LEDs) were fabricated by combining the flip-chip dev...
AbstractAlloy 3J40 is a nickel-based alloy with high hardness and high elasticity. Alloy 3J40 was wi...
AbstractThe effects of alloy elements on the precipitation behaviours of TCP and γ’phases in new typ...
AbstractA new type of Fe-C-Si-B alloy was developed. The investigation on microstructure details and...
AbstractThe flow stress behaviors and microstructure characteristics of C-276 alloy were investigate...
AbstractA new-type Mn-Ni damping alloy named Mn 40 with the Mn content of 40wt% was developed. The X...
AbstractUsing pure Nb and Nb5Si3 metal powder as raw material, Nb/Nb5Si3 alloys with three different...
AbstractThe effect of Re on the recrystallization behavior of a Ni3Al based single crystal alloy has...
AbstractCr-Al-Si and Cr-Al coatings were prepared on Ni3Al-Mo single crystal alloys by the powder pa...
AbstractNb-xSi(x=3,9)-22Ti-3Cr-3Al-2Hf (at.%) have been successfully prepared by directional solidif...
AbstractThe hot forging deformation experiments of a new type high performance powder metallurgy (P/...
AbstractAl-based amorphous ribbons have been prepared by the melt-spin method, and the amorphous com...
AbstractAs one of the preparation development directions for functional thin-film materials, the per...
AbstractThe TiO2 samples and samples of TiO2 doped with Fe was prepared by sol-gel method with tetra...
AbstractWith different concentration of H3PW12O40•xH2O, conducting polyaniline (PANI) was synthesize...
In this study, the white light emitting diodes (LEDs) were fabricated by combining the flip-chip dev...
AbstractAlloy 3J40 is a nickel-based alloy with high hardness and high elasticity. Alloy 3J40 was wi...
AbstractThe effects of alloy elements on the precipitation behaviours of TCP and γ’phases in new typ...
AbstractA new type of Fe-C-Si-B alloy was developed. The investigation on microstructure details and...
AbstractThe flow stress behaviors and microstructure characteristics of C-276 alloy were investigate...
AbstractA new-type Mn-Ni damping alloy named Mn 40 with the Mn content of 40wt% was developed. The X...
AbstractUsing pure Nb and Nb5Si3 metal powder as raw material, Nb/Nb5Si3 alloys with three different...
AbstractThe effect of Re on the recrystallization behavior of a Ni3Al based single crystal alloy has...
AbstractCr-Al-Si and Cr-Al coatings were prepared on Ni3Al-Mo single crystal alloys by the powder pa...
AbstractNb-xSi(x=3,9)-22Ti-3Cr-3Al-2Hf (at.%) have been successfully prepared by directional solidif...
AbstractThe hot forging deformation experiments of a new type high performance powder metallurgy (P/...
AbstractAl-based amorphous ribbons have been prepared by the melt-spin method, and the amorphous com...
AbstractAs one of the preparation development directions for functional thin-film materials, the per...
AbstractThe TiO2 samples and samples of TiO2 doped with Fe was prepared by sol-gel method with tetra...
AbstractWith different concentration of H3PW12O40•xH2O, conducting polyaniline (PANI) was synthesize...
In this study, the white light emitting diodes (LEDs) were fabricated by combining the flip-chip dev...