Multicore architectures are becoming the main design paradigm for current and future processors. The main reason is that multicore designs provide an effective way of overcoming instruction-level parallelism (ILP) limitations by exploiting thread-level parallelism (TLP). In addition, it is a power and complexity-effective way of taking advantage of the huge number of transistors that can be integrated on a chip. On the other hand, today's higher than ever power densities have made temperature one of the main limitations of microprocessor evolution. Thermal management in multicore architectures is a fairly new area. Some works have addressed dynamic thermal management in bi/quad-core architectures. This work provides insight and explores dif...
In deep submicron circuits, high temperatures have created critical issues in reliability, timing, p...
Fueled by increasing human appetite for high computing performance, semiconductor technology has now...
The relentless increase of power density has rendered temperature a primary design constraint for mi...
Multicore architectures are becoming the main design paradigm for current and future processors. The...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...
Multicore architectures have been ruling the recent microprocessor design trend. This is due to diff...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...
With continued scaling of CMOS technology, power, thermal, and reliability issues threaten to signif...
With continuous IC(Integrated Circuit) technology size scaling, more and more transistors are integr...
Editor's note: Thermal management in high-performance multicore platforms has become exceedingly com...
Recently, processor power density has been increasing at an alarming rate result- ing in high on-chi...
Current multicore platforms contain different types of cores, organized in clusters (e.g., ARM's big...
Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlik...
Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlik...
Multi-core architectures are a promising paradigm to exploit the huge integration density reached by...
In deep submicron circuits, high temperatures have created critical issues in reliability, timing, p...
Fueled by increasing human appetite for high computing performance, semiconductor technology has now...
The relentless increase of power density has rendered temperature a primary design constraint for mi...
Multicore architectures are becoming the main design paradigm for current and future processors. The...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...
Multicore architectures have been ruling the recent microprocessor design trend. This is due to diff...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...
With continued scaling of CMOS technology, power, thermal, and reliability issues threaten to signif...
With continuous IC(Integrated Circuit) technology size scaling, more and more transistors are integr...
Editor's note: Thermal management in high-performance multicore platforms has become exceedingly com...
Recently, processor power density has been increasing at an alarming rate result- ing in high on-chi...
Current multicore platforms contain different types of cores, organized in clusters (e.g., ARM's big...
Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlik...
Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlik...
Multi-core architectures are a promising paradigm to exploit the huge integration density reached by...
In deep submicron circuits, high temperatures have created critical issues in reliability, timing, p...
Fueled by increasing human appetite for high computing performance, semiconductor technology has now...
The relentless increase of power density has rendered temperature a primary design constraint for mi...